International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Mr Hyun Ho KimACD2023-10 

History

Stage
Document
Downloads
Decision Date
Target Date
prePNW
2020-01-22 
PNW
91/1638/NP PDF file 656 kB
2020-01-24 
PRVN
2020-04-172020-04
ACD
91/1667/RVN Word file 147 kB
PDF file 332 kB
2020-09-182021-10
CD
 2021-10


Project

IEC 61189-2-808 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method