SC 86C

Fibre optic systems and active devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 86CWG 4Mr Hideki IsonoPPUB2019-042023

History

Stage
Document
Downloads
Decision Date
Target Date
PWI
2015-10-08 
prePNW
2016-12-09 
PNW
86C/1437/NP PDF file 393 kB
2016-12-162017-01
PRVN
2017-03-102017-03
ACD
86C/1448/RVN PDF file 163 kB
2017-04-072017-05
CD
86C/1469/CD
PDF file 392 kB
2017-06-302017-05
PCC
2017-09-222017-09
ACDV
86C/1491/CC PDF file 108 kB
Word file 31 kB
2017-11-172017-12
TCDV
2017-11-202017-12
CCDV
86C/1493/CDV
PDF file 396 kB
PDF file 459 kB
2018-01-122018-01
PRVC
2018-04-062018-04
AFDIS
86C/1538/RVC PDF file 173 kB
Word file 38 kB
2018-09-072018-09
TFDIS
2018-09-142018-09
DECFDIS
2018-10-292018-11
RFDIS
2018-11-192018-11
CFDIS
86C/1571/FDIS

2019-01-042019-02
PRVD
2019-02-152019-02
APUB
86C/1577/RVD PDF file 130 kB
2019-02-222019-03
BPUB
2019-02-222019-02
PPUB
2019-03-112019-04
 2020-04

Abstract

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

Project

IEC 62148-21:2019 ED1

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

 

 

Associated Documents:

86C/1697/DL

PDF file 124 kB
86C/1663/RR

PDF file 88 kB
86C/1626/DL

PDF file 131 kB
86C/1478/DL

PDF file 114 kB
86C/1357/RM

PDF file 290 kB