TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91 WPUB  

History

Stage
Document
Downloads
Decision Date
Target Date
PPUB
1981-01-01 
WPUB
91/498/MCR PDF file 96 kB
2004-10-15 
  

Abstract

Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

Project

IEC 60249-3-1:1981 ED2

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

 

 

Associated Documents:

52/763/RVS