TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1 Walter HuckPPUB2015-052025

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/965/NP PDF file 592 kB
2011-02-18 
ANW
91/977/RVN PDF file 491 kB
2011-06-172011-07
1CD
91/1030/CD PDF file 574 kB
2012-03-062012-01
CDM
91/1057/CC Word file 168 kB
PDF file 185 kB
2012-09-07 
ACDV
91/1057A/CC Word file 204 kB
PDF file 177 kB
2012-11-062012-11
CCDV
91/1127/CDV
PDF file 305 kB
PDF file 261 kB
2013-10-092013-10
AFDIS
91/1202/RVC Word file 183 kB
PDF file 210 kB
2014-08-222014-04
DECFDIS
2014-11-202014-11
RFDIS
2014-11-272014-12
CFDIS
91/1244/FDIS

2015-01-302015-02
APUB
91/1259/RVD PDF file 106 kB
2015-04-172015-03
BPUB
2015-04-202015-04
PPUB
2015-05-192015-05
 2016-12

Abstract

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Project

IEC 61760-4:2015 ED1

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

 

 

Associated Documents:

91/1415/RR

PDF file 94 kB
SMB/5155/DL

PDF file 207 kB