International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Tsuyoshi YamamotoPPUB2014-102023

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1020/RR PDF file 77 kB
2011-11-22 
1CD
91/1056/CD PDF file 1234 kB
2012-09-072012-06
ACDV
91/1087/CC PDF file 149 kB
2013-02-062013-02
CCDV
91/1090/CDV
PDF file 705 kB
PDF file 780 kB
2013-05-152013-05
AFDIS
91/1150/RVC Word file 178 kB
PDF file 110 kB
2013-11-072013-11
DECFDIS
2014-03-312014-02
RFDIS
2014-04-082014-04
CFDIS
91/1188/FDIS

2014-06-202014-06
APUB
91/1205/RVD PDF file 63 kB
2014-09-182014-08
BPUB
2014-09-192014-09
PPUB
2014-10-092014-10
  

Abstract

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.

Project

IEC 62137-4:2014 ED1

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

 

 

Associated Documents:

112/164/RM

PDF file 291 kB