TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 2 Kaichi TsurutaDELPUB2010-06 

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/808/MCR PDF file 88 kB
2008-08-29 
1CD
91/809/CD PDF file 229 kB
2008-09-052008-09
ACDV
91/839/CC PDF file 175 kB
2009-01-092009-01
CCDV
91/847/CDV PDF file 153 kB
PDF file 178 kB
2009-02-062009-01
CCDV
91/847F/CDV PDF file 178 kB
2009-03-272009-03
AFDIS
91/899/RVC PDF file 218 kB
2009-10-302009-10
DECFDIS
2010-02-082009-11
RFDIS
2010-02-162010-02
CFDIS
91/920/FDIS

2010-03-122010-05
APUB
91/925/RVD PDF file 211 kB
2010-05-172010-05
BPUB
2010-05-182010-05
PPUB
2010-06-102010-06
DELPUB
2017-12-13 
WPUB
  


Project

IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications