TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3 Michael KRAPPDELPUB2007-03 

History

Stage
Document
Downloads
Decision Date
Target Date
CDTR
91/601/DTR PDF file 5924 kB
2006-05-05 
CDTR
91/601A/DTR PDF file 5926 kB
2006-06-02 
APUB
91/636/RVC Word file 181 kB
PDF file 216 kB
2006-10-062006-10
APUB
91/636A/RVC PDF file 267 kB
2006-12-082006-10
DECPUB
2006-12-082007-02
BPUB
2006-12-212007-01
RFDIS
2007-01-08 
PPUB
2007-03-122007-03
DELPUB
2014-10-17 
  

Abstract

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

Project

IEC TR 60068-3-12:2007 ED1

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile