International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1 R. DerksenPPUB2007-032020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/458/MCR PDF file 57 kB
2004-05-28 
1CD
91/461/CD PDF file 129 kB
2004-06-042004-07
CDM
91/534/CC PDF file 120 kB
2005-08-262004-10
ACDV
91/534A/CC PDF file 113 kB
2005-11-112005-11
CCDV
91/569/CDV PDF file 168 kB
2005-11-252005-11
APUB
91/634/RVC PDF file 193 kB
2006-09-222006-07
BPUB
2007-01-242006-11
DECPUB
2007-02-022007-02
BPUB
2007-02-122007-02
RPUB
2007-02-27 
PPUB
2007-04-242007-04
 2020-03

Abstract

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Project

IEC 61760-2:2007 ED2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

 

 

Associated Documents:

91/1586/RR

PDF file 90 kB