International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 12 Dieter BERGMANPPUB2007-112020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/377/NP PDF file 530 kB
2003-03-07 
ANW
91/403/RVN PDF file 121 kB
2003-07-042003-07
CCDV
91/465/CDV PDF file 419 kB
2004-06-182004-03
CDVM
91/551/RVC PDF file 146 kB
2005-09-022005-02
AFDIS
91/551A/RVC PDF file 157 kB
2005-11-182005-10
DECFDIS
2007-06-122007-05
RFDIS
2007-06-182007-06
CFDIS
91/704/FDIS
2007-07-272007-07
APUB
91/736/RVD PDF file 101 kB
2007-10-012007-09
BPUB
2007-10-022007-10
PPUB
2007-10-302007-11
 2019-12

Abstract

IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Project

IEC 61188-5-5:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

 

 

Associated Documents:

91/1592/RR

PDF file 92 kB
SMB/3438/R

PDF file 214 kB
SMB/3086B/INF

PDF file 374 kB