International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1 Rob DERKSENPPUB2006-052020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/230/MCR PDF file 12 kB
2001-02-23 
AMW
91/230A/MCR PDF file 53 kB
2002-09-13 
1CD
91/380/CD PDF file 236 kB
2003-03-142002-11
ACDV
91/429/CC PDF file 238 kB
2003-10-172003-07
CCDV
91/454/CDV PDF file 243 kB
2004-05-212004-02
AFDIS
91/513/RVC Word file 129 kB
PDF file 102 kB
2005-03-112005-01
DECFDIS
2005-10-282005-12
RFDIS
2005-10-312006-01
CFDIS
91/577/FDIS
2006-01-132006-03
APUB
91/588/RVD PDF file 167 kB
2006-03-212006-06
BPUB
2006-03-222006-07
PPUB
2006-04-102006-08
 2018-02

Abstract

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Project

IEC 61760-1:2006 ED2

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

 

 

Associated Documents:

91/908/MCR

PDF file 19 kB
91/1440/RR

PDF file 91 kB
SMB/2397/DL

PDF file 33 kB