TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 4 MERGED 2023

History

Stage
Document
Downloads
Decision Date
Target Date
BPUB
2001-02-16 
RPUB
2001-03-20 
DECFDIS
2001-04-17 
MERGED
2001-05-302019-11
  


Project

IEC 61249-3-5/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films