International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 1Mr Tetsuji KAWAMATACFDIS2021-032026

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1568/RR PDF file 92 kB
2019-04-02 
CD
91/1588/CD
PDF file 813 kB
2019-07-122019-06
PCC
2019-09-062019-09
ACDV
91/1627/CC PDF file 271 kB
Word file 79 kB
2019-12-062020-02
TCDV
2019-12-102020-01
CCDV
91/1630/CDV
PDF file 702 kB
PDF file 680 kB
2020-01-312020-01
PRVC
2020-04-242020-04
AFDIS
91/1658/RVC PDF file 247 kB
Word file 53 kB
2020-07-032020-10
DECFDIS
2020-09-222020-10
RFDIS
2020-09-252020-10
CFDIS
91/1684/FDIS PDF file 1775 kB
2020-11-212020-12
PRVD
 2021-01

Abstract

IEC 61760-3 ED2 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.
Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
This edition includes the following significant technical changes with respect to the previous edition:

  1. change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm);
  2. introduce through-hole vacant method as a solder paste supply method.

Project

IEC 61760-3 ED2

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

 

 

Associated Documents:

91/1567/INF

PDF file 196 kB
91/1560/DC

PDF file 134 kB