TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 3Mr Hiroshi OshimaPPUB2019-062026

History

Stage
Document
Downloads
Decision Date
Target Date
ACD
91/1498/RR PDF file 94 kB
2018-02-14 
CD
91/1499/CD
PDF file 214 kB
2018-02-162018-02
PCC
2018-04-132018-04
ACDV
91/1511/CC PDF file 132 kB
Word file 93 kB
2018-05-042018-08
TCDV
2018-05-072018-08
CCDV
91/1513/CDV
PDF file 208 kB
PDF file 213 kB
2018-06-292018-06
PRVC
2018-09-212018-09
AFDIS
91/1544/RVC PDF file 299 kB
Word file 199 kB
2018-11-092019-01
TFDIS
2019-01-212019-01
DECFDIS
2019-02-212019-03
RFDIS
2019-03-042019-03
CFDIS
91/1566/FDIS

2019-03-292019-05
PRVD
2019-05-102019-05
APUB
91/1580/RVD PDF file 208 kB
2019-05-172019-05
BPUB
2019-05-172019-05
PPUB
2019-06-192019-06
  


Project

IEC 60068-2-69:2017/AMD1:2019 ED3

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

 

Remark:

Target date for the next stage after PRVC changed from 2018-12 to 2019-02 (91/1536/DL).