TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 47WG 2 Jim LynchPPUB2008-022021

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/1753/NP PDF file 241 kB
2004-03-12 
ANW
47/1791/RVN PDF file 201 kB
2004-10-082004-07
ANW
47/1791A/RVN PDF file 139 kB
2004-12-172004-10
1CD
47/1824/CD PDF file 371 kB
2005-06-242005-07
ACDV
47/1844/CC PDF file 169 kB
2005-10-282005-11
ACDV
47/1844A/CC PDF file 525 kB
2005-10-282005-11
CCDV
47/1850/CDV PDF file 370 kB
PDF file 401 kB
2005-12-162005-11
CDVM
47/1888/RVC PDF file 445 kB
2006-09-222006-08
AFDIS
47/1888A/RVC PDF file 440 kB
2007-07-18 
DECFDIS
2007-07-192006-12
RFDIS
2007-08-062007-08
CFDIS
47/1937/FDIS

2007-10-122007-10
APUB
47/1948/RVD PDF file 107 kB
2007-12-192007-12
BPUB
2007-12-202007-12
PPUB
2008-01-302008-01
 2020-10

Abstract

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Project

IEC 60749-37:2008 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

 

 

Associated Documents:

47/2649/RR

PDF file 122 kB