SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2019-12-03

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47D/922/INF

Review of Active Participation of P-members in the Work of  47D 

2020-10-16 N/A
47D/923/DA

Draft agenda for the meeting to be held in on-line meeting (Zoom), from 2020-11-17 (starting time: 6:00(UTC)) to 2020-11-19 (approximate finishing time: 8:00(UTC))

2020-10-16 N/A
47D/924/INF

Compilation of comments on 47D/920/DC: Proposal for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals

2020-10-16 N/A
47D/921/RVN

Result of Voting on 47D/919/NP - PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-10-02 U
SC 47A
TC 91
47D/920/DC

Proposal from the Japanese National Committee for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals

2020-05-08 2020-06-19 N/A Report of Comments
47D/919/NP

PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-02-07 2020-05-01 U Voting Result
SC 47A
TC 91
47D/918/INF

Comments received on 47D/917/DC: Call for comments / proposals on the future Technical Report, “Standardization Roadmap for Fan-Out Packages” prepared by Korean National Committee

2020-01-31 N/A