International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

TC 91 Working Documents since 2019-08-12

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

91/1662/CC

Compilation of Comments on 91/1631/CD - IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

2020-07-24 Y
TC 40
TC 47
SC 47A
SC 47E
SC 47F
SC 48B
TC 51
91/1659/CC

Compilation of Comments on 91/1634/CD - IEC 61189-2-501 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

2020-07-17 Y
91/1660/CD

IEC 63215-2 ED1: Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

2020-07-17 2020-10-09 Y
TC 22
TC 47
91/1658/RVC

Result of Voting on 91/1630/CDV - IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

2020-07-03 Y
TC 40
91/1656/CC

Compilation of Comments on 91/1629/CD - IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2020-06-26 Y
SC 47D
91/1657/RVC

Result of Voting on 91/1637/CDV - IEC 61188-6-2 ED1: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

2020-06-26 Y
91/1650/CDV

IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

2020-06-19 2020-09-11 Y
91/1653/RVD

Result of Voting on 91/1648/FDIS - IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2020-06-19 Y
91/1654/CC

Compilation of Comments on 91/1620/CD - IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

2020-06-19 Y
91/1645/CDV

IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

2020-06-05 2020-08-28 Y
91/1646/CDV

IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

2020-06-05 2020-08-28 Y
91/1652/INF

Comments received on 91/1641/DC: Proposed technical report on ‘Voiding in solder joints of printed board assemblies for use in automotive electronic control units – best practices’

2020-06-05 N/A
91/1651/RVN

Result of Voting on 91/1617/NP - PNW 91-1617: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

2020-05-01 Y
91/1648/FDIS

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2020-04-24 2020-06-05 Y Voting Result
91/1649/DTR

IEC TR 62878-2-8 ED1: Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

2020-04-24 2020-06-19 U Voting Result
TC 47
91/1647/CD

IEC 61189-2-807 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

2020-04-17 2020-06-12 Y Report of Comments
91/1628B/INF

Next TC 91 Working Group meetings to be held in Tokyo, Japan from 1 to 4 June 2020 (online registration)

2020-04-03 N/A
91/1644/RVD

Result of Voting on 91/1639/FDIS - IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

2020-03-27 Y
91/1636/CDV

IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

2020-02-28 2020-05-22 Y Voting Result
91/1637/CDV

IEC 61188-6-2 ED1: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

2020-02-28 2020-05-22 Y Voting Result
91/1642/RVC

Result of Voting on 91/1602/CDV - IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2020-02-28 Y
91/1643/INF

Comments received on 91/1635/DC: Maintenance – Call for comments / proposals for amendment / revision on IEC 60068-2-83 Edition 1.0 and call for experts for maintenance team

2020-02-28 N/A
91/1641/DC

Call for comments on proposed Technical Report on ‘Voiding in solder joints of printed board assemblies for use in automotive electronic control units – best practices’

2020-02-14 2020-03-27 N/A Report of Comments
91/1639/FDIS

IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

2020-02-07 2020-03-20 Y Voting Result
91/1640/DTR

IEC TR 61188-8 ED1: Circuit boards and circuit board assemblies – Design and use – Part 8: 3D shape data for CAD component library

2020-02-07 2020-04-03 U Voting Result
91/1630/CDV

IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

2020-01-31 2020-04-24 Y Voting Result
TC 40
91/1638/NP

PNW 91-1638: Thermal resistance test of lamination layer

2020-01-24 2020-04-17 U Voting Result
91/1606A/CC

Compilation of Comments on 91/1569/CD - IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

2019-12-27 Y
91/1607A/CC

Compilation of Comments on 91/1571/CD - IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

2019-12-27 Y
91/1622/CDV

IEC 60068-2-21 ED7: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

2019-12-27 2020-03-20 Y Voting Result
91/1635/DC

Maintenance – Call for comments / proposals for amendment / revision on IEC 60068-2-83 Ed. 1.0 and call for experts for maintenance team

2019-12-27 2020-02-07 N/A Report of Comments
91/1633/RVN

Result of Voting on 91/1593/NP - PNW 91-1593: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

2019-12-20 Y
91/1634/CD

IEC 61189-2-501 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

2019-12-20 2020-03-13 Y Report of Comments
91/1628A/INF

Replaced by 91/1628B/INF

2019-12-13 N/A
91/1629/CD

IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2019-12-13 2020-03-06 Y Report of Comments
SC 47D
91/1631/CD

IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

2019-12-13 2020-03-06 Y Report of Comments
TC 40
TC 47
SC 47A
SC 47E
SC 47F
SC 48B
TC 51
91/1632/RVN

Result of Voting on 91/1594/NP - PNW 91-1594: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

2019-12-13 Y
91/1627/CC

Compilation of Comments on 91/1588/CD - IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

2019-12-06 Y
TC 40
91/1628/INF

Replaced by 91/1628A/INF

2019-12-06 N/A
91/1626/CD

IEC 63251 ED1: Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

2019-11-29 2020-02-21 Y Report of Comments
TC 86
91/1625/CC

Compilation of Comments on 91/1587/CD - IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

2019-11-15 Y
91/1619/CC

Compilation of Comments on 91/1584/CD - IEC 60068-2-21 ED7: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

2019-11-08 Y
91/1620/CD

IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

2019-11-08 2020-01-31 Y Report of Comments
91/1621/RVC

Result of Voting on 91/1579/CDV - IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

2019-11-08 Y
91/1623/CC

Compilation of Comments on 91/1604/CD - IEC 61188-6-2 ED1: Printed boards and printed board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

2019-11-08 Y
91/1624/RM

Report of the meeting held in Shanghai, China on 25th October 2019 from 09:00 h to 16:00 h

2019-11-08 N/A
91/1618/DL

List of decisions taken at the meeting of TC 91, held in Shanghai, China from 2019-10-25

2019-11-01 N/A
91/1608A/INF

Liaison Reports

2019-10-18 N/A
91/1617/NP

PNW 91-1617: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

2019-10-11 2020-01-03 Y Voting Result
91/1585A/DA

Revised draft agenda for the meeting to be held in Shanghai, China, from 2019-10-25 (starting time: 9:00) to 2019-10-25 (approximate finishing time: 16:00)

2019-09-20 N/A
91/1602(F)/CDV

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2019-09-20 2019-12-06 Y
91/1616/RVD

Result of Voting on 91/1597/FDIS - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

2019-09-20 Y
TC 40
TC 47
SC 47D
91/1601/CDV

IEC 61189-5-601 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

2019-09-13 2019-12-06 Y Voting Result
91/1602/CDV

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

2019-09-13 2019-12-06 Y Voting Result
91/1610/INF

Comments received on 91/1600/DC: Call for comments / proposals on the working draft guide: Guidelines for defining halogen content terminology in IEC publications

2019-09-13 N/A
91/1611/CC

Compilation of Comments on 91/1543/CD - IEC 61189-2-801 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

2019-09-13 Y
91/1612/CC

Compilation of Comments on 91/1545/CD - IEC 61189-2-803 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

2019-09-13 Y
91/1613/CC

Compilation of Comments on 91/1546/CD - IEC 61189-2-804 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

2019-09-13 Y
91/1614/CC

Compilation of Comments on 91/1548/CD - IEC 61249-6-3 ED1: Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

2019-09-13 Y
91/1615/INF

Review of Active Participation of P-members in the Work of TC 91

2019-09-13 N/A
91/1609/RVN

Result of Voting on 91/1581/NP - PNW 91-1581 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder powders

2019-09-06 Y
91/1605/RQ

Result of Questionnaire on 91/1591/Q: Proposal for a new title for IEC 61188 series

2019-08-30 N/A
91/1606/CC

Compilation of Comments on 91/1569/CD - IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

2019-08-30 Y
91/1607/CC

Compilation of Comments on 91/1571/CD - IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

2019-08-30 Y
91/1608/INF

Replaced by 91/1608A/INF

2019-08-30 N/A