International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Working Documents since 2018-09-23

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Downloads

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Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47/2593/CC

Compilation of Comments on 47/2528/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

2019-09-20 Y
TC 91
TC 104
47/2592/CD

IEC 63244-1 ED1: Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

2019-09-13 2019-12-06 Y
47/2582A/DA

Revised draft agenda for the TC 47 meeting to be held in Shanghai, China on 2019-10-18 (09:00 – 12:00)

2019-09-06 N/A
47/2589/AC

Next meeting of TC 47 and its Subcommittees 47A, 47D, 47E and 47F to be held in Frankfurt, Germany from 16 to 20 November 2020 (announcement)

2019-09-06 N/A
47/2590/INF

Review of Active Participation of P-members in the Work of TC 47

2019-09-06 N/A
47/2591/INF

Comments received on 47/2586/DC: Review and Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2019-09-06 N/A
47/2584/CDV

IEC 60749-41 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

2019-08-23 2019-11-15 Y
47/2576A/NP

PNW 47-2576: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2019-07-19 2019-08-09 U Voting Result
47/2577A/NP

PNW 47-2577: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2019-07-19 2019-08-09 U Voting Result
47/2580/CDV

IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- Linear sliding mode triboelectric energy harvesting

2019-07-19 2019-10-11 N
TC 124
47/2587/RVC

Result of Voting on 47/2524/CDV - IEC 62779-4 ED1: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

2019-07-19 Y
SC 62D
47/2575/CDV

IEC 60749-15 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

2019-07-05 2019-09-27 Y
47/2585/RVD

Result of Voting on 47/2573/FDIS - IEC 62830-6 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6 - Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

2019-07-05 N
47/2586/DC

Review and Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2019-07-05 2019-08-30 N/A Report of Comments
47/2583/RQ

Result of Questionnaire on 47/2574/Q: Extension of the term of office for Chair of SC 47D: Semiconductor devices packaging

2019-06-28 N/A
47/2570/CDV

IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-06-14 2019-09-06 N Voting Result
TC 91
TC 104
47/2582/DA

Draft agenda for the TC 47 meeting to be held in Shanghai, China on 2019-10-18 (09:00 – 12:00)

2019-06-14 N/A
47/2581/CC

Compilation of Comments on 47/2540/CD - IEC 62435-8 ED1: Long-term storage of electronic components – Part 8: Passive electronic devices

2019-06-07 Y
TC 40
TC 107
47/2562/CDV

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2019-05-24 2019-08-16 Y Voting Result
TC 91
TC 101
TC 104
47/2563/CDV

IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2019-05-24 2019-08-16 Y Voting Result
47/2579/RVD

Result of Voting on 47/2565/FDIS - IEC 60749-20-1 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

2019-05-24 Y
47/2578/NP

PNW 47-2578: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2019-05-17 2019-08-09 U Voting Result
47/2573/FDIS

IEC 62830-6 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6 - Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

2019-05-10 2019-06-21 N Voting Result
47/2574/Q

Extension of the term of office for Chair of SC 47D: Semiconductor devices packaging

2019-05-10 2019-06-21 N/A Report of Comments
47/2555/CDV

IEC 62435-7 ED1: Long-term storage of electronic components – Part 7: Micro-electromechanical devices

2019-05-03 2019-07-26 Y Voting Result
SC 47F
47/2571/RQ

Result of Questionnaire on 47/2550/Q: Nomination of liaison representative of IEC/TC 47 to IEC/TC 113 (Nanotechnology for electrotechnical products and systems)

2019-05-03 N/A
47/2572/RR

Review report of IEC 60749-15 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

2019-05-03 Y
47/2569/RVN

Result of Voting on 47/2529/NP - PNW 47-2529: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8- Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

2019-04-26 U
TC 124
47/2567/CC

Compilation of Comments on 47/2527/CD - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2019-04-19 N
TC 91
TC 104
47/2568/RVD

Result of Voting on 47/2548/FDIS - IEC 63150-1 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations

2019-04-19 N
47/2566/RVD

Result of Voting on 47/2547/FDIS - IEC 62951-6 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

2019-04-12 N
TC 119
47/2545/CDV

IEC 62830-5 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

2019-04-05 2019-06-28 N Voting Result
47/2559/RVN

Result of Voting on 47/2532/NP - PNW 47-2532: Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

2019-04-05 Y
47/2560/RR

Review report of IEC 60749-30 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2019-04-05 Y
TC 91
TC 101
TC 104
47/2561/RR

Review report of IEC 60749-20 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2019-04-05 Y
47/2564/RVD

Result of Voting on 47/2541/FDIS - IEC 62951-2 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices

2019-04-05 N
TC 119
47/2565/FDIS

IEC 60749-20-1 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

2019-04-05 2019-05-17 Y Voting Result
47/2554/RVD

Result of Voting on 47/2539/FDIS - IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

2019-03-22 Y
TC 91
TC 104
47/2557/CC

Compilation of Comments on 47/2526/CD - IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- linear sliding mode triboelectric energy harvesting

2019-03-22 N
TC 124
47/2558/RVC

Result of Voting on 47/2491/CDV - IEC 62435-3 ED1: Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data

2019-03-22 Y
TC 107
47/2553/RVD

Result of Voting on 47/2538/FDIS - IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

2019-03-15 Y
TC 91
47/2556/RVC

Result of Voting on 47/2508/CDV - IEC 62830-6 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6 - Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

2019-03-15 N
47/2552/INF

Withdrawal of document 47/2546/Q: Nomination of Convenor in TC 47/WG 2, Climatic and mechanical tests

2019-03-08 N/A
47/2547/FDIS

IEC 62951-6 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

2019-02-22 2019-04-05 N Voting Result
TC 119
47/2548/FDIS

IEC 63150-1 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations

2019-02-22 2019-04-05 N Voting Result
47/2541/FDIS

IEC 62951-2 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices

2019-02-15 2019-03-29 N Voting Result
TC 119
47/2542/RVD

Result of Voting on 47/2533/FDIS - IEC 62951-7 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

2019-02-15 N
47/2543/RVD

Result of Voting on 47/2534/FDIS - IEC 62951-5 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

2019-02-15 N
TC 119
47/2544/CC

Compilation of Comments on 47/2502/CD - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) - Part 1: Fast BTI Test method

2019-02-15 N
TC 91
TC 104
47/2549/RVD

Result of Voting on 47/2531/FDIS - IEC 62951-4 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices

2019-02-15 N
TC 119
47/2550/Q

Nomination of liaison representative of IEC/TC 47 to IEC/TC 113 (Nanotechnology for electrotechnical products and systems)

2019-02-15 2019-03-29 N/A Report of Comments
47/2551/RVD

Result of Voting on 47/2530/FDIS - IEC 62830-4 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

2019-02-15 N
47/2538/FDIS

IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

2019-01-25 2019-03-08 Y Voting Result
TC 91
47/2539/FDIS

IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

2019-01-25 2019-03-08 Y Voting Result
TC 91
TC 104
47/2525A/RM

Unconfirmed Minutes of TC 47 Plenary meeting held in Busan, Rep. of KOREA, Oct. 19, 2018

2019-01-18 N/A
47/2537/RQ

Result of Questionnaire on 47/2510/Q: Withdrawal of IEC 60749-16:2003 ED1

2019-01-18 N/A
47/2540/CD

IEC 62435-8 ED1: Long-term storage of electronic components – Part 8: Passive electronic devices

2019-01-18 2019-04-12 Y Report of Comments
TC 40
TC 107
47/2524/CDV

IEC 62779-4 ED1: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

2019-01-11 2019-04-05 Y Voting Result
SC 62D
47/2535/RVC

Result of Voting on 47/2488/CDV - IEC 60749-20-1 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

2019-01-11 Y
47/2536/CC

Compilation of Comments on 47/2507/CD - IEC 62435-7 ED1: Long-term storage of electronic components – Part 7: Micro-electromechanical devices

2019-01-11 Y
SC 47F
47/2533/FDIS

IEC 62951-7 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

2018-12-21 2019-02-01 N Voting Result
47/2534/FDIS

IEC 62951-5 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

2018-12-21 2019-02-01 N Voting Result
TC 119
47/2530/FDIS

IEC 62830-4 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

2018-12-14 2019-01-25 N Voting Result
47/2531/FDIS

IEC 62951-4 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices

2018-12-14 2019-01-25 N Voting Result
TC 119
47/2532/NP

PNW 47-2532: Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

2018-12-14 2019-02-08 Y Voting Result
47/2527/CD

IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2018-12-07 2019-03-01 N Report of Comments
TC 91
TC 104
47/2528/CD

IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

2018-12-07 2019-03-01 Y Report of Comments
TC 91
TC 104
47/2529/NP

PNW 47-2529: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8- Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

2018-12-07 2019-03-01 U Voting Result
TC 124
47/2521A/RVC

Result of Voting on 47/2474/CDV - IEC 63068-1 ED1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

2018-11-30 N
TC 91
TC 104
47/2522A/RVC

Result of Voting on 47/2475/CDV - IEC 63068-2 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection

2018-11-30 N
TC 91
TC 104
47/2526/CD

IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- linear sliding mode triboelectric energy harvesting

2018-11-30 2019-02-22 N Report of Comments
TC 124
47/2523/CC

Compilation of Comments on 47/2471/CD - IEC 62830-5 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

2018-11-23 N
47/2525/RM

Replaced by 47/2525A/RM

2018-11-23 N/A
47/2518A/CC

Compilation of Comments on 47/2504/CD - IEC 62435-8 ED1: Long-term storage of electronic components – Part 8: Passive electronic devices

2018-11-09 Y
TC 40
TC 107
47/2519/DL

List of decisions taken at the meeting of TC 47, held in Busan, Rep. of Korea on 19 October, 2018

2018-11-02 N/A
47/2520/RVN

Result of Voting on 47/2476/NP - PNW 47-2476: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

2018-11-02 Y
TC 91
TC 104
47/2521/RVC

Result of Voting on 47/2474/CDV - IEC 63068-1 ED1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

2018-11-02 N
TC 91
TC 104
47/2522/RVC

Result of Voting on 47/2475/CDV - IEC 63068-2 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection

2018-11-02 N
TC 91
TC 104
47/2518/CC

Compilation of Comments on 47/2504/CD - IEC 62435-8 ED1: Long-term storage of electronic components – Part 8: Passive electronic devices

2018-10-19 Y
TC 40
TC 107
47/2508/CDV

IEC 62830-6 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6 - Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

2018-10-12 2019-01-04 N Voting Result
47/2517/RVC

Result of Voting on 47/2448/CDV - IEC 63150-1 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations

2018-10-12 N
47/2515/RVC

Result of Voting on 47/2464/CDV - IEC 62951-5 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

2018-10-05 N
TC 119
47/2516/RVN

Result of Voting on 47/2490/NP - PNW 47-2490: Future IEC 62951-8: Semiconductor devices – Flexible and stretchable semiconductor devices – Part 8: Stability test of flexible organic semiconductor under bending conditions

2018-10-05 E
47/2513/RVC

Result of Voting on 47/2465/CDV - IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

2018-09-28 Y
TC 91
47/2514/RVC

Result of Voting on 47/2468/CDV - IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

2018-09-28 Y
TC 91
TC 104