Next TC 91 Working Group meetings to be held in Tokyo, Japan from 1 to 4 June 2020 (online registration)

IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Result of Voting on 91/1594/NP - PNW 91-1594: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Compilation of Comments on 91/1588/CD - IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Replaced by 91/1628A/INF

IEC 63251 ED1: Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

Compilation of Comments on 91/1587/CD - IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Compilation of Comments on 91/1584/CD - IEC 60068-2-21 ED7: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

Result of Voting on 91/1579/CDV - IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Compilation of Comments on 91/1604/CD - IEC 61188-6-2 ED1: Printed boards and printed board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Report of the meeting held in Shanghai, China on 25th October 2019 from 09:00 h to 16:00 h

List of decisions taken at the meeting of TC 91, held in Shanghai, China from 2019-10-25

Liaison Reports

PNW 91-1617: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Revised draft agenda for the meeting to be held in Shanghai, China, from 2019-10-25 (starting time: 9:00) to 2019-10-25 (approximate finishing time: 16:00)

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Result of Voting on 91/1597/FDIS - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 61189-5-601 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Comments received on 91/1600/DC: Call for comments / proposals on the working draft guide: Guidelines for defining halogen content terminology in IEC publications

Compilation of Comments on 91/1543/CD - IEC 61189-2-801 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Compilation of Comments on 91/1545/CD - IEC 61189-2-803 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

Compilation of Comments on 91/1546/CD - IEC 61189-2-804 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

Compilation of Comments on 91/1548/CD - IEC 61249-6-3 ED1: Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

Review of Active Participation of P-members in the Work of TC 91

Result of Voting on 91/1581/NP - PNW 91-1581 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder powders

Result of Questionnaire on 91/1591/Q: Proposal for a new title for IEC 61188 series

Compilation of Comments on 91/1569/CD - IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Compilation of Comments on 91/1571/CD - IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Replaced by 91/1608A/INF

IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Resignation and nomination of TC 91 WG 15 co-convener

IEC 61188-6-2 ED1: Printed boards and printed board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

PNW 91-1594: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Result of Voting on 91/1583/DTR - IEC TR 61191-7 ED1: Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Outlines of the proposed IEEE standards offered by IEEE to be adopted as IEC/IEEE dual-logo publications in TC 91

Compilation of Comments on 91/1534/CD - IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Compilation of Comments on 91/1518/CD - IEC 61189-5-601 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Call for comments / proposals on the working draft guide: Guidelines for defining halogen content terminology in IEC publications

Review report of IEC 61188-5-2 to 61188-5-6 Ed.1 and IEC 61188-5-8 Ed.1

PNW 91-1593: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

Compilation of Comments on 91/1554/CD - IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Review report of IEC 61760-2 Ed.2: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Result of Voting on 91/1557/CDV - IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

PNW 91-1590: MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

Proposal for a new title for IEC 61188 series

IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

IEC 60068-2-21 ED7: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Draft agenda for the meeting to be held in Shanghai, China, from 2019-10-25 (starting time: 9:00) to 2019-10-25 (approximate finishing time: 16:00)

PNW 91-1581 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder powders

Result of Voting on 91/1558/NP - PNW 91-1558: Test Method for Mechanical Property of Flexible Optic-Electric Circuit Boards under Thermal Stress

IEC TR 61191-7 ED1: Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Result of Voting on 91/1566/FDIS - IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Result of Voting on 91/1550/CDV - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Result of Voting on 91/1500/DTR - An intercomparison evaluation to implement the use of fine pitch test structures for surface insulation resistance (SIR) testing of solder fluxes according to IEC 61189-5-501

Result of Voting on 91/1561/FDIS - IEC 61188-6-4 ED1: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design – Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Result of Voting on 91/1562/FDIS - IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies

Result of Voting on 91/1514/NP - PNW 91-1514: PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES – DESIGN AND USE Part 8: 3D shape data specification for CAD component library.

Result of Voting on 91/1551/NP - PNW 91-1551: Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity

Review report of IEC 61192-2 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

Review report of IEC 61192-3 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Review report of IEC 61192-4 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Comments received on 91/1560/DC: Revision of IEC 61760-3 Edition 1.0 and call for experts for maintenance team

Review report of IEC 61760-3 Ed.1: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Review report of IEC 61189-5 Ed.1 and IEC 61189-6 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies and Part 6: Test methods for materials used in manufacturing electronic assemblies

IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Comments received on 91/1555/DC: Call for comments on proposed Technical Report on “Technical cleanliness of components and printed board assemblies” as a joint project between WG 1 and WG 2

IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

Result of Questionnaire on 91/1556/Q: Questionnaire on the nomination of a convenor of TC 91/WG 2: Requirements for electronics assemblies

IEC 61188-6-4 ED1: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design – Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies

Next TC 91 Working Group meetings to be held in Frankfurt, Germany from 20 to 24 May 2019 (on-line registration)

Result of Voting on 91/1495/CDV - IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies

Result of Voting on 91/1553/DTR - IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Maintenance – Call for comments / proposals for amendment / revisions on IEC 61760-3 Ed. 1.0 and call for experts for maintenance team

PNW 91-1558: Test Method for Mechanical Property of Flexible Optic-Electric Circuit Boards under Thermal Stress

Call for comments on proposed Technical Report on “Technical cleanliness of components and printed board assemblies” as a joint project between WG 1 and WG 2

Questionnaire on the nomination of a convenor of TC 91/WG 2: Requirements for electronics assemblies

IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards