International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Working Documents since 2018-07-22

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47F/336/CDV

IEC 62047-37 ED1: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2019-07-19 2019-10-11 N
TC 49
47F/339/NP

PNW 47F-339: Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

2019-07-05 2019-09-27 U
47F/335A/RVC

Result of Voting on 47F/320/CDV - IEC 62047-35 ED1: Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

2019-06-28 Y
47F/337/DC

Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2019-06-21 2019-09-06 N/A
47F/338/DA

Draft agenda for the meeting to be held in Shanghai, China, on 2019-10-17 (starting time: 9:00 to approximate finishing time: 12:00)

2019-06-21 N/A
47F/330A/CC

Compilation of Comments on 47F/324/CD - IEC 62047-37 ED1: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2019-05-31 N
TC 49
47F/335/RVC

Result of Voting on 47F/320/CDV - IEC 62047-35 ED1: Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

2019-03-22 Y
47F/331/RVD

Result of Voting on 47F/326/FDIS - IEC 62047-31 ED1: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2019-03-15 N
47F/332/RVD

Result of Voting on 47F/327/FDIS - IEC 62047-33 ED1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2019-03-15 N
47F/333/RVD

Result of Voting on 47F/328/FDIS - IEC 62047-34 ED1: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer

2019-03-15 N
47F/334/RVD

Result of Voting on 47F/329/FDIS - IEC 62047-36 ED1: Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2019-03-15 N
TC 49
47F/330/CC

Compilation of Comments on 47F/324/CD - IEC 62047-37 ED1: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2019-03-01 N
TC 49
47F/326/FDIS

IEC 62047-31 ED1: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2019-01-25 2019-03-08 N Voting Result
47F/327/FDIS

IEC 62047-33 ED1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2019-01-25 2019-03-08 N Voting Result
47F/328/FDIS

IEC 62047-34 ED1: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer

2019-01-25 2019-03-08 N Voting Result
47F/329/FDIS

IEC 62047-36 ED1: Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2019-01-25 2019-03-08 N Voting Result
TC 49
47F/325/RVD

Result of Voting on 47F/322/FDIS - IEC 62047-32 ED1: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of the MEMS resonators

2018-12-28 N
47F/320/CDV

IEC 62047-35 ED1: Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

2018-12-21 2019-03-15 Y Voting Result
47F/319A/RVN

Result of Voting on 47F/316/NP - PNW 47F-316: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2018-11-30 N
TC 49
47F/324/CD

IEC 62047-37 ED1: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2018-11-30 2019-02-22 N Report of Comments
TC 49
47F/311A/RVC

Result of Voting on 47F/304/CDV - IEC 62047-33 ED1: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

2018-11-23 N
47F/312A/RVC

Result of Voting on 47F/305/CDV - IEC 62047-34 ED1: Semiconductor devices - Micro-electromechanical devices - Part 34: Test method for MEMS piezoresistive pressure-sensitive device on wafer

2018-11-23 N
47F/313A/RVC

Result of Voting on 47F/306/CDV - IEC 62047-36 ED1: Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

2018-11-23 N
TC 49
47F/315A/RVC

Result of Voting on 47F/308/CDV - IEC 62047-31 ED1: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2018-11-23 N
47F/323/RM

Unconfirmed minutes of SC 47F plenary meeting held at Room “316, 317 EXC1”, BEXCO (Busan Exhibition & Convention Center), Busan, Korea on October. 18, 2018, from 9:30 am to 12:30 pm

2018-11-23 N/A
47F/321A/DL

List of decisions taken at the meeting of SC 47F, held in Busan, Korea on 18 October 2018

2018-11-16 N/A
47F/322/FDIS

IEC 62047-32 ED1: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of the MEMS resonators

2018-11-09 2018-12-21 N Voting Result
47F/307A/CC

Compilation of Comments on 47F/303/CD - IEC 62047-35 ED1: Semiconductor devices – Micro-electromechanical devices – Part 35: Standard test procedure for the anti-failure robustness of flexible or foldable electro-mechanical devices against bending deformation

2018-11-02 Y
47F/321/DL

Replaced by 47F/321A/DL

2018-11-02 N/A
47F/319/RVN

Result of Voting on 47F/316/NP - PNW 47F-316: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2018-09-28 N
TC 49
47F/314A/DA

Revised draft agenda for the meeting to be held in Busan, Korea, on 2018-10-18 (starting time: 9:00 to approximate finishing time: 12:00)

2018-09-14 N/A
47F/317/INF

Review of Active Participation of P-members in the Work of SC 47F

2018-09-14 N/A
47F/318/INF

Report of comments on 47F/310/DC: Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2018-09-14 N/A
47F/315/RVC

Result of Voting on 47F/308/CDV - IEC 62047-31 ED1: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2018-07-27 N
47F/316/NP

PNW 47F-316: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

2018-07-27 2018-09-21 N Voting Result
TC 49