TC 47

Semiconductor devices

 
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TC 47 Working Documents since 2020-03-07

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Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47/2691/RR

Review report of IEC 60749-10 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

2021-03-05 Y
TC 91
47/2679/CDV

IEC 63275-1 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2021-02-26 2021-05-21 Y
TC 91
TC 104
47/2680/CDV

IEC 63275-2 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation due to body diode operation

2021-02-26 2021-05-21 Y
TC 91
TC 104
47/2681/CDV

IEC 63284 ED1: Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors

2021-02-26 2021-05-21 Y
TC 91
TC 104
47/2689/NP

PNW 47-2689 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module

2021-02-12 2021-05-07 U
47/2686/RVD

Result of Voting on 47/2676/FDIS - IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- Linear sliding mode triboelectric energy harvesting

2021-02-05 N
TC 124
47/2687/FDIS

IEC 63229 ED1: Semiconductor devices – Classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2021-02-05 2021-03-19 N
TC 91
TC 104
47/2688/CD

IEC 63287-2 ED1: Semiconductor devices – Guidelines for reliability qualification plans – Part 2: Concept of mission profile

2021-02-05 2021-04-30 Y
47/2676(F)/FDIS

IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- Linear sliding mode triboelectric energy harvesting

2021-01-15 2021-01-29 N Voting Result
TC 124
47/2684/RM

Unconfirmed minutes of TC 47 plenary meeting held online on 2020-11-20

2021-01-15 N/A
47/2685/NP

PNW 47-2685 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence

2021-01-15 2021-04-09 U
47/2682/RVN

Result of Voting on 47/2665/NP - PNW 47-2665 ED1: Semiconductor devices – Semiconductor devices for IOT system – Part 1: Test method of sound variation detection

2021-01-08 U
ISO/IEC JTC 1/SC 41
47/2683/NP

PNW 47-2683 ED1: Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 2: Human arm swing motion

2021-01-08 2021-04-02 U
47/2670A/DL

List of decisions taken at the meeting of  47 held online on 2020-11-20

2020-12-18 N/A
47/2672/RVC

Result of Voting on 47/2621/CDV - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2020-12-18 N
TC 91
TC 104
47/2673/CC

Compilation of Comments on 47/2622/CD - IEC 63275-1 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2020-12-18 Y
TC 91
TC 104
47/2674/CC

Compilation of Comments on 47/2623/CD - IEC 63275-2 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2020-12-18 Y
TC 91
TC 104
47/2675/CC

Compilation of Comments on 47/2624/CD - IEC 63284 ED1: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-12-18 Y
TC 91
TC 104
47/2676/FDIS

IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- Linear sliding mode triboelectric energy harvesting

2020-12-18 2021-01-29 N Voting Result
TC 124
47/2677/DTR

IEC TR 63357 ED1: Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

2020-12-18 2021-02-12 N Voting Result
TC 69
47/2678/RVD

Result of Voting on 47/2668/FDIS - IEC 62830-5 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

2020-12-18 N
47/2667/CDV

IEC 62435-9 ED1: Electronic components – Long-term storage of electronic semiconductor devices - Part 9: Special Cases

2020-12-11 2021-03-05 Y Voting Result
TC 107
47/2671/NP

PNW 47-2671 ED1: Semiconductor devices - Fault test method for automotive vehicles - Part 1: General conditions and definitions

2020-12-11 2021-03-05 U Voting Result
TC 69
47/2670/DL

Replaced by 47/2670A/DL

2020-12-04 N/A
47/2661(F)/CDV

IEC 60749-28 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2020-11-27 2021-02-12 Y Voting Result
TC 91
TC 101
TC 104
47/2668(F)/FDIS

IEC 62830-5 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

2020-11-27 2020-12-11 N Voting Result
47/2669/RVD

Result of Voting on 47/2664/FDIS - IEC 62435-7 ED1: Electronic components - Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices

2020-11-27 Y
SC 47F
47/2661/CDV

IEC 60749-28 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2020-11-20 2021-02-12 Y Voting Result
TC 91
TC 101
TC 104
47/2655/CDV

IEC 62830-8 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8- Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

2020-10-30 2021-01-22 N Voting Result
TC 124
47/2664(F)/FDIS

IEC 62435-7 ED1: Electronic components - Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices

2020-10-30 2020-11-20 Y Voting Result
SC 47F
47/2668/FDIS

IEC 62830-5 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

2020-10-30 2020-12-11 N Voting Result
47/2651/CDV

IEC 60749-37 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

2020-10-23 2021-01-15 Y Voting Result
47/2652/CDV

IEC 60749-39 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

2020-10-23 2021-01-15 Y Voting Result
47/2653/CDV

IEC 63244-1 ED1: Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

2020-10-23 2021-01-15 Y Voting Result
47/2660A/DA

Revised draft agenda for the TC 47 meeting to be held online on 2020-11-20 (from 12:00 to 16:00 UTC)

2020-10-16 N/A
47/2666/INF

Review of Active Participation of P-members in the Work of  47 

2020-10-16 N/A
47/2664/FDIS

IEC 62435-7 ED1: Electronic components - Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices

2020-10-09 2020-11-20 Y Voting Result
SC 47F
47/2665/NP

PNW 47-2665 ED1: Semiconductor devices – Semiconductor devices for IOT system – Part 1: Test method of sound variation detection

2020-10-09 2021-01-01 U Voting Result
ISO/IEC JTC 1/SC 41
47/2662/RVC

Result of Voting on 47/2580/CDV - IEC 62830-7 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- Linear sliding mode triboelectric energy harvesting

2020-10-02 N
TC 124
47/2663/RVN

Result of Voting on 47/2635/NP - PNW 47-2635: Semiconductor devices – Guidelines for reliability qualification plans – Part 2: Concept of Mission profile

2020-10-02 Y
47/2657/RVC

Result of Voting on 47/2614/CDV - IEC 63287-1 ED1: Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for LSI reliability qualification

2020-09-25 Y
47/2658/AC

Next meeting of  47 and its Subcommittees 47A, 47D, 47E and 47F originally taking place in Frankfurt, Germany from 16 to 20 November 2020 is now to be a virtual meeting

2020-09-25 N/A
47/2659/DC

Review and Maintenance – call for comments/ proposals on publications coming up for review and a call for experts

2020-09-25 2020-11-06 N/A Report of Comments
47/2660/DA

Draft agenda for the TC 47 meeting to be held online on 2020-11-20 (from 12:00 to 16:00 UTC)

2020-09-25 N/A
47/2654/CC

Compilation of Comments on 47/2601/CD - IEC 62830-8 ED1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8- Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

2020-09-11 N
TC 124
47/2656/CD

IEC 62951-9 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices – Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells

2020-09-11 2020-12-04 N Report of Comments
TC 124
47/2648/CD

IEC 62951-8 ED1: Semiconductor devices - Flexible and stretchable semiconductor devices – Part 8: Test method for stretchability, flexibility and stability of flexible resistive memory

2020-08-21 2020-11-13 N Report of Comments
TC 124
47/2649/RR

Review report of IEC 60749-37 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

2020-08-21 Y
47/2650/RR

Review report of IEC 60749-39 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

2020-08-21 Y
47/2647/RVN

Result of Voting on 47/2596/NP - PNW 47-2596: Future IEC 62951-8: Semiconductor devices - Flexible and strechable semiconductor devices – Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory

2020-07-31 N
TC 124
47/2645/RVN

Result of Voting on 47/2617/NP - PNW 47-2617: Future IEC 62435-9: Electronic components – Long-term storage of electronic semiconductor devices - Part 9: Special Cases

2020-07-17 Y
TC 107
47/2646/RVD

Result of Voting on 47/2634/FDIS - IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2020-07-17 Y
47/2644/RVD

Result of Voting on 47/2633/FDIS - IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-07-10 Y
TC 91
TC 101
TC 104
47/2642/RQ

Result of Questionnaire on 47/2632/Q: Merging WG 2 with WG 3 and nomination of co-onvenor in  47/ 2

2020-07-03 N/A
47/2643/RVD

Result of Voting on 47/2631/FDIS - IEC 60749-41 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

2020-07-03 Y
47/2637/RVD

Result of Voting on 47/2627/FDIS - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

2020-06-26 N
TC 91
TC 104
47/2638/RVD

Result of Voting on 47/2628/FDIS - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-06-26 N
TC 91
TC 104
47/2639/RVD

Result of Voting on 47/2630/FDIS - IEC 60749-15 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

2020-06-26 Y
47/2640/RVN

Result of Voting on 47/2610/NP - PNW 47-2610: Future IEC 62951-9: Semiconductor devices - Flexible and strechable semiconductor devices – Part 9: Performance and reliability testing methods of  one transistor and one resistor (1T1R) resistive memory cells

2020-06-26 N
TC 124
47/2641/RVN

Result of Voting on 47/2594/NP - PNW 47-2594: Semiconductor devices - Semiconductor devices for IoT-based fire detection system– Part 1: Test method of semiconductor devices for IoT-based sound variation fire detection system

2020-06-26 U
ISO/IEC JTC 1/SC 41
47/2633(F)/FDIS

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-06-19 2020-07-03 Y Voting Result
TC 91
TC 101
TC 104
47/2634(F)/FDIS

IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2020-06-19 2020-07-10 Y Voting Result
47/2636/CC

Compilation of Comments on 47/2592/CD - IEC 63244-1 ED1: Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

2020-06-19 Y
47/2631(F)/FDIS

IEC 60749-41 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

2020-06-05 2020-06-26 Y Voting Result
47/2630(F)/FDIS

IEC 60749-15 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

2020-05-29 2020-06-19 Y Voting Result
47/2634/FDIS

IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2020-05-29 2020-07-10 Y Voting Result
47/2635/NP

PNW 47-2635: Semiconductor devices – Guidelines for reliability qualification plans – Part 2: Concept of Mission profile

2020-05-29 2020-08-21 Y Voting Result
47/2633/FDIS

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-05-22 2020-07-03 Y Voting Result
TC 91
TC 101
TC 104
47/2631/FDIS

IEC 60749-41 ED1: Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices

2020-05-15 2020-06-26 Y Voting Result
47/2632/Q

Merging WG 2 with WG 3 and nomination of co-convenor in TC 47 / WG 2  

2020-05-15 2020-06-26 N/A Report of Comments
47/2630/FDIS

IEC 60749-15 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

2020-05-08 2020-06-19 Y Voting Result
47/2621/CDV

IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2020-05-01 2020-07-24 N Voting Result
TC 91
TC 104
47/2627/FDIS

IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

2020-05-01 2020-06-12 N Voting Result
TC 91
TC 104
47/2628/FDIS

IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-05-01 2020-06-12 N Voting Result
TC 91
TC 104
47/2629/RVC

Result of Voting on 47/2562/CDV - IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-05-01 Y
TC 91
TC 101
TC 104
47/2625/RR

Review report of IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2020-04-17 Y
TC 91
TC 101
TC 104
47/2626/RVC

Result of Voting on 47/2563/CDV - IEC 60749-20 ED3: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

2020-04-17 Y
47/2622/CD

IEC 63275-1 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2020-03-27 2020-06-19 Y Report of Comments
TC 91
TC 104
47/2623/CD

IEC 63275-2 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2020-03-27 2020-06-19 Y Report of Comments
TC 91
TC 104
47/2624/CD

IEC 63284 ED1: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-03-27 2020-06-19 Y Report of Comments
TC 91
TC 104