SC 47D |
Boîtiers des dispositifs semi-conducteurs |

Référence, Titre
|
Downloads
|
Date de Circulation |
Date de Fermeture |
CENELEC
|
Votes / Commentaires |
Aux comit?s Authoris?s |
---|---|---|---|---|---|---|
47D/924A/INF
[Revised compilation of comments on 47D/920/DC: Proposal for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals]
Titre français non disponible
|
2020-12-18 | N/A | ||||
47D/926/NP
[PNW 47D-926 ED1: Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis]
Titre français non disponible
|
2020-12-18 | 2021-03-12 | U | |||
47D/925/RM
[Unconfirmed Minutes of SC 47D Meeting held by Zoom on-line web meeting from 2020-11-17 to 2020-11-19]
Titre français non disponible
|
2020-12-11 | N/A | ||||
47D/922/INF
[Review of Active Participation of P-members in the Work of 47D ]
Titre français non disponible
|
2020-10-16 | N/A | ||||
47D/923/DA
[Draft agenda for the meeting to be held in on-line meeting (Zoom), from 2020-11-17 (starting time: 6:00(UTC)) to 2020-11-19 (approximate finishing time: 8:00(UTC))]
Titre français non disponible
|
2020-10-16 | N/A | ||||
47D/924/INF
[Replaced by 47D/924A/INF]
Titre français non disponible
|
2020-10-16 | N/A | ||||
47D/921/RVN
[Result of Voting on 47D/919/NP - PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements]
Titre français non disponible
|
2020-10-02 | U |
SC 47A
TC 91
|
|||
47D/920/DC
[Proposal from the Japanese National Committee for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals]
Titre français non disponible
|
2020-05-08 | 2020-06-19 | N/A | Report of Comments | ||
47D/919/NP
[PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements]
Titre français non disponible
|
2020-02-07 | 2020-05-01 | U | Voting Result |
SC 47A
TC 91
|
|
47D/918/INF
[Comments received on 47D/917/DC: Call for comments / proposals on the future Technical Report, “Standardization Roadmap for Fan-Out Packages” prepared by Korean National Committee]
Titre français non disponible
|
2020-01-31 | N/A |
