International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Document de Travail depuis 2018-08-20

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Date de

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Date de

Fermeture

CENELEC

Votes /

Commentaires

Aux comités

Authorisés

91/1597/FDIS

IEC 62878-1 ED1: Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)

2019-08-02 2019-09-13 Y
TC 40
TC 47
SC 47D
91/1603/INF

[Resignation and nomination of TC 91 WG 15 co-convener ]

Titre français non disponible

2019-08-02 N/A
91/1604/CD

[IEC 61188-6-2 ED1: Printed boards and printed board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)]

Titre français non disponible

2019-08-02 2019-09-27 Y
91/1594/NP

[PNW 91-1594: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials]

Titre français non disponible

2019-07-26 2019-10-18 U
91/1595/RVDTR

[Result of Voting on 91/1583/DTR - IEC TR 61191-7 ED1: Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies]

Titre français non disponible

2019-07-26 U
91/1596/INF

[Outlines of the proposed IEEE standards offered by IEEE to be adopted as IEC/IEEE dual-logo publications in TC 91]

Titre français non disponible

2019-07-26 N/A
91/1598/CC

[Compilation of Comments on 91/1534/CD - IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)]

Titre français non disponible

2019-07-26 Y
91/1599/CC

[Compilation of Comments on 91/1518/CD - IEC 61189-5-601 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards]

Titre français non disponible

2019-07-26 Y
91/1600/DC

[Call for comments / proposals on the working draft guide: Guidelines for defining halogen content terminology in IEC publications]

Titre français non disponible

2019-07-26 2019-09-06 N/A
91/1592/RR

[Review report of IEC 61188-5-2 to 61188-5-6 Ed.1 and IEC 61188-5-8 Ed.1]

Titre français non disponible

2019-07-19 Y
91/1593/NP

[PNW 91-1593: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA]

Titre français non disponible

2019-07-19 2019-10-11 U
91/1576A/CC

[Compilation of Comments on 91/1554/CD - IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards]

Titre français non disponible

2019-07-12 Y
91/1586/RR

Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application

2019-07-12 Y
TC 40
TC 47
SC 47A
SC 47E
SC 47F
SC 48B
TC 51
91/1587/CD

[IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads]

Titre français non disponible

2019-07-12 2019-10-04 Y
91/1588/CD

IEC 61760-3 ED2: Technique du montage en surface - Partie 3 : Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)

2019-07-12 2019-09-06 Y
TC 40
91/1589/RVC

[Result of Voting on 91/1557/CDV - IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate]

Titre français non disponible

2019-07-12 Y
TC 40
TC 47
SC 47A
SC 47D
TC 86
91/1590/NP

[PNW 91-1590: MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards]

Titre français non disponible

2019-07-12 2019-10-04 U
91/1591/Q

[Proposal for a new title for IEC 61188 series]

Titre français non disponible

2019-07-12 2019-08-23 N/A
91/1578/CDV

IEC 60194-1 ED1: Conception, fabrication et assemblage de cartes imprimées - Vocabulaire - Partie 1: Usage commun des techniques d’assemblage des composants électroniques et des cartes imprimées

2019-06-28 2019-09-20 N
TC 40
TC 47
SC 47A
SC 47D
91/1579/CDV

IEC 61189-5-504 ED1: Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-504: Méthodes d’essai générales pour les matériaux et les ensembles - Essai de contamination ionique des procédés (PICT)

2019-06-28 2019-09-20 Y
91/1584/CD

IEC 60068-2-21 ED7: Essais d'environnement - Partie 2-21: Essais - Essai U: Robustesse des sorties et des dispositifs de montage incorporés

2019-06-14 2019-09-06 Y
91/1585/DA

[Draft agenda for the meeting to be held in Shanghai, China, from 2019-10-25 (starting time: 9:00) to 2019-10-25 (approximate finishing time: 16:00)]

Titre français non disponible

2019-06-14 N/A
91/1581/NP

[PNW 91-1581 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder powders]

Titre français non disponible

2019-05-24 2019-08-16 U Voting Result
91/1582/RVN

[Result of Voting on 91/1558/NP - PNW 91-1558: Test Method for Mechanical Property of Flexible Optic-Electric Circuit Boards under Thermal Stress]

Titre français non disponible

2019-05-24 U
TC 86
91/1583/DTR

[IEC TR 61191-7 ED1: Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies]

Titre français non disponible

2019-05-24 2019-07-19 U Voting Result
91/1580/RVD

[Result of Voting on 91/1566/FDIS - IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method]

Titre français non disponible

2019-05-17 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1577/RVC

[Result of Voting on 91/1550/CDV - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates]

Titre français non disponible

2019-05-10 Y
TC 40
TC 47
SC 47D
91/1530A/RVDTR

[Result of Voting on 91/1500/DTR - An intercomparison evaluation to implement the use of fine pitch test structures for surface insulation resistance (SIR) testing of solder fluxes according to IEC 61189-5-501]

Titre français non disponible

2019-04-26 U
91/1572/RVD

[Result of Voting on 91/1561/FDIS - IEC 61188-6-4 ED1: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design – Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design]

Titre français non disponible

2019-04-12 Y
91/1573/RVD

[Result of Voting on 91/1562/FDIS - IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies ]

Titre français non disponible

2019-04-12 Y
TC 47
91/1574/RVN

[Result of Voting on 91/1514/NP - PNW 91-1514: PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES – DESIGN AND USE Part 8: 3D shape data specification for CAD component library. ]

Titre français non disponible

2019-04-12 U
91/1575/RVN

[Result of Voting on 91/1551/NP - PNW 91-1551: Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity]

Titre français non disponible

2019-04-12 U
SC 47D
91/1576/CC

[Compilation of Comments on 91/1554/CD - IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards]

Titre français non disponible

2019-04-12 Y
91/1538A/RR

[Review report of IEC 61192-2 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies]

Titre français non disponible

2019-04-05 Y
91/1539A/RR

[Review report of IEC 61192-3 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies ]

Titre français non disponible

2019-04-05 Y
91/1540A/RR

[Review report of IEC 61192-4 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies ]

Titre français non disponible

2019-04-05 Y
91/1567/INF

[Comments received on 91/1560/DC: Revision of IEC 61760-3 Edition 1.0 and call for experts for maintenance team]

Titre français non disponible

2019-04-05 N/A
91/1568/RR

Technique du montage en surface - Partie 3 : Méthode normalisée relative à la spécification des composants pour le brasage par refusion à trous traversants (THR, Through Hole Reflow)

2019-04-05 Y
TC 40
91/1569/CD

[IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes]

Titre français non disponible

2019-04-05 2019-06-28 Y Report of Comments
91/1570/RR

[Review report of IEC 61189-5 Ed.1 and IEC 61189-6 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies and Part 6: Test methods for materials used in manufacturing electronic assemblies]

Titre français non disponible

2019-04-05 Y
91/1571/CD

[IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies]

Titre français non disponible

2019-04-05 2019-06-28 Y Report of Comments
91/1566/FDIS

IEC 60068-2-69/AMD1 ED3: Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc : Essai de brasabilité des composants électroniques et cartes imprimées par la méthode de la balance de mouillage (mesure de la force)

2019-03-29 2019-05-10 Y Voting Result
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1565/INF

[Comments received on 91/1555/DC: Call for comments on proposed Technical Report on “Technical cleanliness of components and printed board assemblies” as a joint project between WG 1 and WG 2]

Titre français non disponible

2019-03-22 N/A
91/1557/CDV

IEC 62878-2-5 ED1: Substrat avec appareil(s) intégré(s) - Partie 2-5: Mise en œuvre d’un format de données 3D pour un substrat avec appareil(s) intégré(s)

2019-03-15 2019-06-07 Y Voting Result
TC 40
TC 47
SC 47A
SC 47D
TC 86
91/1564/RQ

[Result of Questionnaire on 91/1556/Q: Questionnaire on the nomination of a convenor of TC 91/WG 2: Requirements for electronics assemblies]

Titre français non disponible

2019-03-08 N/A
91/1561/FDIS

IEC 61188-6-4 ED1: Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4: Conception de la zone de report – Exigences génériques pour les dessins dimensionnels de composants montés en surface (CMS) du point de vue de la conception de la zone de report

2019-02-22 2019-04-05 Y Voting Result
91/1562/FDIS

IEC 60068-2-82 ED2: Essais d'environnement - Partie 2-82: Essais - Essai XW1: Méthodes de vérification des trichites pour les composants et les pièces utilisés dans les ensembles électroniques

2019-02-22 2019-04-05 Y Voting Result
TC 47
91/1563/INF

[Next TC 91 Working Group meetings to be held in Frankfurt, Germany from 20 to 24 May 2019 (on-line registration)]

Titre français non disponible

2019-02-22 N/A
91/1531A/RVC

[Result of Voting on 91/1495/CDV - IEC 60068-2-82 ED2: Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies]

Titre français non disponible

2019-02-15 Y
TC 47
91/1559/RVDTR

[Result of Voting on 91/1553/DTR - IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards]

Titre français non disponible

2019-02-15 U
TC 40
TC 47
SC 47A
SC 47D
TC 86
91/1560/DC

[Maintenance – Call for comments / proposals for amendment / revisions on IEC 61760-3 Ed. 1.0 and call for experts for maintenance team]

Titre français non disponible

2019-02-15 2019-03-29 N/A Report of Comments
91/1558/NP

[PNW 91-1558: Test Method for Mechanical Property of Flexible Optic-Electric Circuit Boards under Thermal Stress]

Titre français non disponible

2019-01-25 2019-04-19 U Voting Result
TC 86
91/1555/DC

[Call for comments on proposed Technical Report on “Technical cleanliness of components and printed board assemblies” as a joint project between WG 1 and WG 2]

Titre français non disponible

2019-01-18 2019-03-01 N/A Report of Comments
91/1556/Q

[Questionnaire on the nomination of a convenor of TC 91/WG 2: Requirements for electronics assemblies]

Titre français non disponible

2019-01-18 2019-03-01 N/A Report of Comments
91/1550/CDV

IEC 62878-1 ED1: Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)

2019-01-11 2019-04-05 Y Voting Result
TC 40
TC 47
SC 47D
91/1554/CD

[IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards]

Titre français non disponible

2018-12-28 2019-03-22 Y Report of Comments
91/1553/DTR

[IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards]

Titre français non disponible

2018-12-14 2019-02-08 U Voting Result
TC 40
TC 47
SC 47A
SC 47D
TC 86
91/1549/CC

[Compilation of Comments on 91/1522/CD - IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate]

Titre français non disponible

2018-11-23 Y
TC 40
TC 47
SC 47A
SC 47D
TC 86
91/1551/NP

[PNW 91-1551: Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity]

Titre français non disponible

2018-11-23 2019-01-18 U Voting Result
SC 47D
91/1552/RM

[Report of the meeting held in Busan, Korea, Republic of on 26th October 2018 from 09:00 h to 16:00 h]

Titre français non disponible

2018-11-23 N/A
91/1548/CD

[IEC 61249-6-3 ED1: Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards ]

Titre français non disponible

2018-11-16 2019-02-08 Y Report of Comments
91/1537/RR

[Review report of IEC 61192-1 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 1: General ]

Titre français non disponible

2018-11-09 Y
91/1538/RR

[Replaced by 91/1538A/RR]

Titre français non disponible

2018-11-09 Y
91/1539/RR

[Replaced by 91/1539A/RR]

Titre français non disponible

2018-11-09 Y
91/1540/RR

[Replaced by 91/1540A/RR]

Titre français non disponible

2018-11-09 Y
91/1541/RR

[Review report of IEC 61192-5 Ed.1: Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies ]

Titre français non disponible

2018-11-09 Y
91/1542/RR

[Review report of IEC TR 61926-1-1 Ed.1: Design automation - Part 1-1: Harmonization of ATLAS test languages]

Titre français non disponible

2018-11-09 U
91/1543/CD

[IEC 61189-2-801 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials]

Titre français non disponible

2018-11-09 2019-02-01 Y Report of Comments
91/1544/RVC

[Result of Voting on 91/1513/CDV - IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method]

Titre français non disponible

2018-11-09 Y
SC 23J
TC 40
TC 47
SC 47D
SC 48B
TC 51
91/1545/CD

[IEC 61189-2-803 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board]

Titre français non disponible

2018-11-09 2019-02-01 Y Report of Comments
91/1546/CD

[IEC 61189-2-804 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300]

Titre français non disponible

2018-11-09 2019-02-01 Y Report of Comments
91/1547/RQ

[Result of Questionnaire on 91/1523/Q: Proposal to withdraw IEC TR 61926-1-1 Ed.1.0: Design Automation – Part 1-1: Harmonization of ATLAS test language]

Titre français non disponible

2018-11-09 N/A
91/1536/DL

[List of decisions taken at the meeting of TC 91, held in Busan, Korea, Republic of from 2018-10-26]

Titre français non disponible

2018-11-02 N/A
91/1535/RR

[Review report of IEC 61189-5 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies and IEC 61189-6 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies ]

Titre français non disponible

2018-10-12 Y
91/1519B/DA

[Revised draft agenda for the meeting to be held in Busan, Korea, Republic of, from 2018-10-26 (starting time: 9:00) to 2018-10-26 (approximate finishing time: 17:00)]

Titre français non disponible

2018-10-05 N/A
91/1533A/INF

[Liaison Reports]

Titre français non disponible

2018-10-05 N/A
91/1534/CD

[IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)]

Titre français non disponible

2018-10-05 2018-12-28 Y Report of Comments
91/1533/INF

[Replaced by 91/1533A/INF]

Titre français non disponible

2018-09-28 N/A
91/1519A/DA

[Replaced by 91/1519B/DA]

Titre français non disponible

2018-09-21 N/A
91/1527/CC

[Compilation of Comments on 91/1460/CD - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies]

Titre français non disponible

2018-09-14 N
TC 40
TC 47
SC 47A
SC 47D
91/1528/RVN

[Result of Voting on 91/1494/NP - PNW 91-1494: Endurance test methods for die attach materials applied to power electronics devices – Part 1: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices]

Titre français non disponible

2018-09-14 U
TC 22
TC 47
91/1529/RVN

[Result of Voting on 91/1497/NP - PNW 91-1497: Endurance test methods for die attach materials applied to power electronic devices – Part 3: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices]

Titre français non disponible

2018-09-14 U
TC 22
TC 47
91/1530/RVDTR

[Result of Voting on 91/1500/DTR - An intercomparison evaluation to implement the use of fine pitch test structures for surface insulation resistance (SIR) testing of solder fluxes according to IEC 61189-5-501]

Titre français non disponible

2018-09-14 U
91/1531/RVC

[Replaced by 91/1531A/RVC]

Titre français non disponible

2018-09-14 Y
TC 47
91/1532/INF

[Review of Active Participation of P-members in the Work of TC 91]

Titre français non disponible

2018-09-14 N/A
91/1526/RVC

[Result of Voting on 91/1489/CDV - IEC 61188-6-4 ED1: Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMD from viewpoint of land pattern design]

Titre français non disponible

2018-08-31 Y
91/1525/CC

[Compilation of Comments on 91/1467/CD - IEC 61189-5-504 ED1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)]

Titre français non disponible

2018-08-24 Y