International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Working Documents since 2019-09-26

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47D/920/DC

Proposal from the Japanese National Committee for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals

2020-05-08 2020-06-19 N/A Report of Comments
47D/919/NP

PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-02-07 2020-05-01 U Voting Result
SC 47A
TC 91
47D/918/INF

Comments received on 47D/917/DC: Call for comments / proposals on the future Technical Report, “Standardization Roadmap for Fan-Out Packages” prepared by Korean National Committee

2020-01-31 N/A
47D/917/DC

Proposal from the Korean National Committee for a future Technical Report, “Standardization Roadmap for Fan-Out Packages” – Call for comments/proposals

2019-11-29 2020-01-24 N/A Report of Comments
47D/916A/RM

Unconfirmed Minutes of SC 47D Meeting held in Shanghai, China from 2019-10-15 to 2019-10-17

2019-11-15 N/A
47D/916/RM

Replaced by 47D/916A/RM

2019-10-25 N/A