International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
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SC 47A Working Documents since 2018-09-22

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

Of interest to

Committees

47A/1086/CC

Compilation of Comments on 47A/1080/CD - IEC 62228-7 ED1: Integrated circuits - EMC evaluation of transceivers – Part 7: CXPI transceivers

2019-09-13 Y
47A/1079A/DA

Revised draft agenda for the SC 47A meeting to be held in Shanghai, China, on 2019-10-17 (from 14:00 to 17:00)

2019-09-06 N/A
47A/1085/INF

Review of Active Participation of P-members in the Work of SC 47A

2019-09-06 N/A
47A/1081/NP

PNW 47A-1081: Integrated circuits - Three dimensional integrated circuits - Part 5: Known-good-die test of partly integrated circuits

2019-08-23 2019-11-15 U
47A/1082/NP

PNW 47A-1082: INTEGRATED CIRCUITS - Three dimensional integrated circuits - Part 6: Thermomechanical reliability test method

2019-08-23 2019-11-15 U
47A/1083/DC

Proposal from the Korean National Committee for a future Technical Report, “INTEGRATED CIRCUITS – Part X: Standardization Roadmap for Fan-Out Packages” – Call for comments/ proposals

2019-08-23 2019-10-04 N/A
47A/1084/DC

Proposal from the Korean National Committee for a future Technical Report, “INTEGRATED CIRCUITS – Three Dimensional Integrated Circuits – Part x-x: Thermal measurement of warpage” – Call for comments/ proposals

2019-08-23 2019-10-04 N/A
47A/1075A/CC

Compilation of Comments on 47A/1071/CD - IEC 62228-5 ED1: Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers

2019-06-14 Y
47A/1079/DA

Draft agenda for the SC 47A meeting to be held in Shanghai, China, on 2019-10-17 (from 14:00 to 17:00)

2019-06-14 N/A
47A/1080/CD

IEC 62228-7 ED1: Integrated circuits - EMC evaluation of transceivers – Part 7: CXPI transceivers

2019-06-14 2019-09-06 Y Report of Comments
47A/1076A/CC

Compilation of Comments on 47A/1072/CD - IEC 61967-4 ED2: Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method

2019-05-31 Y
47A/1078/CC

Compilation of Comments on 47A/1074/CD - IEC 62433-6 ED1: EMC IC modelling – Part 6: Models of integrated circuits for Pulse immunity behavioural simulation - Conducted Pulse Immunity modelling (ICIM-CPI)

2019-05-24 Y
47A/1077/RQ

Results of 47A/1073/Q: Maintenance Programme – Call for comments / proposals for confirmation / revision / withdrawal on publications coming up for review and a call for experts for new maintenance team

2019-05-03 N/A
47A/1075/CC

Compilation of Comments on 47A/1071/CD - IEC 62228-5 ED1: Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers

2019-04-05 Y
47A/1076/CC

Compilation of Comments on 47A/1072/CD - IEC 61967-4 ED2: Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method

2019-04-05 Y
47A/1074/CD

IEC 62433-6 ED1: EMC IC modelling – Part 6: Models of integrated circuits for Pulse immunity behavioural simulation - Conducted Pulse Immunity modelling (ICIM-CPI)

2019-02-22 2019-04-19 Y Report of Comments
47A/1073/Q

Maintenance Programme – Call for comments / proposals for confirmation / revision / withdrawal on publications coming up for review and a call for experts for new maintenance team

2019-02-15 2019-04-19 N/A Report of Comments
47A/1072/CD

IEC 61967-4 ED2: Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method

2018-12-21 2019-03-15 Y Report of Comments
47A/1051B/RVN

Result of Voting on 47A/1043/NP - PNW 47A-1043: Future IEC 62228-5: Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers

2018-12-14 Y
47A/1071/CD

IEC 62228-5 ED1: Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers

2018-12-14 2019-03-08 Y Report of Comments
47A/1070A/RM

Report of the meeting held in BEXCO Room 313, Busan, Korea, Republic of on 2018-10-18 (starting time: 14:00 ending time: 17:00)

2018-12-07 N/A
47A/1068/CC

Compilation of Comments on 47A/1053/CD - IEC 62433-6 ED1: EMC IC modelling – Part 6: Models of integrated circuits for Pulse immunity behavioural simulation - Conducted Pulse Immunity modelling(ICIM-CPI)

2018-11-16 Y
47A/1069/RVC

Result of Voting on 47A/1050/CDV - IEC 62228-3 ED1: Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

2018-11-16 Y
47A/1070/RM

Replaced by 47A/1070A/RM

2018-11-16 N/A
47A/1064/RVD

Result of Voting on 47A/1060/FDIS - IEC 63011-1 ED1: Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

2018-11-02 Y
SC 47D
TC 91
47A/1065/RVD

Result of Voting on 47A/1061/FDIS - IEC 63011-2 ED1: Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

2018-11-02 Y
SC 47D
TC 91
47A/1066/RVD

Result of Voting on 47A/1062/FDIS - IEC 61967-1 ED2: Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

2018-11-02 Y
47A/1067/RR

Review report of IEC 61967-4 Ed.1: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

2018-11-02 Y
47A/1063/RVD

Result of Voting on 47A/1057/FDIS - IEC 63011-3 ED1: Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

2018-10-19 Y
SC 47D
TC 91