TC 91

Result of Voting on 91/1701/FDIS - IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 61691-8 ED1: Behavioural languages – Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual (IEEE Std 1666.1-2016)

IEC 62530-2 ED1: SystemVerilog – Part 2: Universal Verification Methodology Language Reference Manual (IEEE Std 1800.2-2017)

IEC 62530 ED3: SystemVerilog - Unified Hardware Design, Specification, and Verification Language (IEEE Std 1800-2017)

IEC 61691-6 ED2: Behavioural languages – Part 6: VHDL Analog and Mixed-Signal Extensions (IEEE Std 1076.1-2017)

IEC 61636 ED2: Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE Std 1636-2018)

IEC 61636-1 ED2: Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML) (IEEE Std 1636.1-2018)

PNW 91-1718 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

PNW 91-1719 ED1: Future 61249-2-XXX:MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - Part 2-XXX: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,unclad

PNW 91-1710 ED1: Electrical test method of printed circuit board by measuring the capacitance

IEC 61189-2-807 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

PNW 91-1706 ED1: Endurance test methods for die attach materials – Part 1: General specification

PNW 91-1707 ED1: Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

Result of Voting on 91/1666/CDV - IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

PNW 91-1709 ED1: Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

Result of Voting on 91/1688/FDIS - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

Result of Voting on 91/1684/FDIS - IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

IEC TR 62878-2-9 ED1: Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

Proposal regarding maintenance of IEC 61191-1, IEC 61191-2, IEC 61191-3, and IEC 61191-4

IEC 61188-6-3 ED1: Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

IEC 61189-2-805 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Result of Voting on 91/1655/CDV - IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

Comments received on 91/1681/DC: Maintenance – Call for comments / proposals for amendment / revisions on IEC TR 60068-3-12 Ed. 2 and call for experts for maintenance team

IEC 61249-6-3 ED1: Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

Report of the meeting held by online on 16^th and 17^th November 2020 from 12:00 h to 15:00 h in UTC

Compilation of Comments on 91/1647/CD - IEC 61189-2-807 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

Result of Voting on 91/1665/DTR - IEC TR 61191-8 ED1: Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices

IEC 61189-2-808 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

Call for comments on proposed Technical Report on “SURFACE MOUNTING TECHNOLOGY – Part X: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method”

Review report of IEC 61188-5-2 ED1, IEC 61188-5-3 ED1, IEC 61188-5-4 ED1, IEC 61188-5-5 ED1, IEC 61188-5-6 ED1 and IEC 61188-5-8 ED1

PNW 91-1693 ED1: DEVICE EMBEDDING ASSEMBLY TECHNOLOGY – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

Revised Result of Voting on 91/1638/NP - PNW 91-1638: Thermal resistance test of lamination layer

Result of Voting on 91/1650/CDV - IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Result of Voting on 91/1622/CDV - IEC 60068-2-21 ED7: Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

List of decisions taken at the meeting of  91, held online from 2020-11-16 to 2020-11-17

Revised Result of Voting on 91/1617/NP - PNW 91-1617: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Compilation of Comments on 91/1626/CD - IEC 63251 ED1: Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

Maintenance – Call for comments / proposals for amendment / revisions on IEC TR 60068-3-12 Ed. 2 and call for experts for maintenance team

Result of Voting on 91/1640/DTR - IEC TR 61188-8 ED1: Circuit boards and circuit board assemblies – Design and use – Part 8: 3D shape data for CAD component library

Revised Compilation of Comments on 91/1548/CD - IEC 61249-6-3 ED1: Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Revised draft agenda for the online meeting to be held on 2020-11-16 and 2020-11-17 (starting time: 21:00 (JST), approximate finishing time: 24:00 (JST) on both days)

Liaison Reports

Reviewed Publication Plan

Review of Active Participation of P-members in the Work of  91

Result of Voting on 91/1601/CDV - IEC 61189-5-601 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Result of Voting on 91/1578/CDV - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

TC 91 Remote Plenary Guide

Result of Voting on 91/1636/CDV - IEC 61188-6-1 ED1: Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Result of Voting on 91/1645/CDV - IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Result of Voting on 91/1646/CDV - IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Review report of IEC 61188-1-1 Ed.1: Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

Review report of IEC 61188-1-2 Ed.1: Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

Draft agenda for the online meeting to be held on 2020-11-16 and 2020-11-17 (starting time: 21:00 (JST), approximate finishing time: 24:00 (JST) on both days)

IEC 61189-2-501 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

IEC 62878-2-602 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC TR 61191-8 ED1: Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices

IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

Next virtual meeting of TC 91 to be held from 2020-11-02 to 2020-11-17

Compilation of Comments on 91/1631/CD - IEC 61760-2 ED3: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Compilation of Comments on 91/1634/CD - IEC 61189-2-501 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

IEC 63215-2 ED1: Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

Result of Voting on 91/1630/CDV - IEC 61760-3 ED2: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Compilation of Comments on 91/1629/CD - IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Result of Voting on 91/1637/CDV - IEC 61188-6-2 ED1: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

IEC 60068-2-20 ED6: Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Result of Voting on 91/1648/FDIS - IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Compilation of Comments on 91/1620/CD - IEC 61189-5-301 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

IEC 61189-5-501 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

IEC 61189-5-502 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Comments received on 91/1641/DC: Proposed technical report on ‘Voiding in solder joints of printed board assemblies for use in automotive electronic control units – best practices’

Result of Voting on 91/1617/NP - PNW 91-1617: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

IEC 61760-1 ED3: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

IEC TR 62878-2-8 ED1: Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

IEC 61189-2-807 ED1: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

Next TC 91 Working Group meetings to be held in Tokyo, Japan from 1 to 4 June 2020 (online registration)

Result of Voting on 91/1639/FDIS - IEC 61189-5-504 ED1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)