SC 47D

IEC TR 63378-1 ED1: Thermal standardization on semiconductor packages – Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

PNW 47D-927 ED1: Future 63xxx-3 Ed.1: Thermal standardization on semiconductor packaging – Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis

Revised compilation of comments on 47D/920/DC: Proposal for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals

PNW 47D-926 ED1: Future 63xxx-2 Ed.1: Thermal standardization on semiconductor packaging – Part 2: 3D thermal simulation models of semiconductor packages for steady-state analysis

Unconfirmed Minutes of SC 47D Meeting held by Zoom on-line web meeting from 2020-11-17 to 2020-11-19

Review of Active Participation of P-members in the Work of  47D 

Draft agenda for the meeting to be held in on-line meeting (Zoom), from 2020-11-17 (starting time: 6:00(UTC)) to 2020-11-19 (approximate finishing time: 8:00(UTC))

Replaced by 47D/924A/INF

Result of Voting on 47D/919/NP - PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

Proposal from the Japanese National Committee for a future Technical Report, “Thermal management of semiconductor packages” – Call for comments/proposals