International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
TC 91 Subcommittee(s) and/or Working Group(s)
Label |
Title |
|---|---|
| Working Groups | |
| WG 1 | Requirements for electronic components |
| WG 2 | Requirements for electronics assemblies |
| WG 3 | Measuring and test methods for electronics assemblies |
| WG 4 | Printed boards and materials |
| WG 5 | Terms and definitions |
| WG 6 | Device Embedding assembly technology |
| WG 10 | Measuring and test methods for printed boards and printed board materials |
| WG 12 | Design methodology and data transfer of circuit boards and circuit board assemblies |
| WG 13 | Design Automation: Component, Circuit and System Description Language |
| WG 14 | Design Automation: Library of reusable Parts for Electrotechnical Products |
| WG 15 | Design Automation: Testing of Electrotechnical Products |
| Joint Working Groups | |
| JWG 9 | Optical functionality for electronic assemblies Managed by TC 86 |
| Advisory Groups | |
| AG 16 | Standardization Strategy |
TC 91 Membership
 Country | Country Code  | P/O Status | IEC Membership |
|---|---|---|---|
AT | O-Member | Full Member | |
BE | O-Member | Full Member | |
BR | O-Member | Full Member | |
BG | O-Member | Full Member | |
CN | P-Member | Full Member | |
CZ | O-Member | Full Member | |
DK | O-Member | Full Member | |
FI | P-Member | Full Member | |
FR | O-Member | Full Member | |
DE | P-Member | Full Member | |
HU | O-Member | Full Member | |
IN | P-Member | Full Member | |
IL | O-Member | Full Member | |
IT | P-Member | Full Member | |
JP | P-Member | Full Member | |
KR | P-Member | Full Member | |
NL | P-Member | Full Member | |
NO | O-Member | Full Member | |
PL | O-Member | Full Member | |
PT | O-Member | Full Member | |
RO | O-Member | Full Member | |
RU | P-Member | Full Member | |
RS | O-Member | Full Member | |
SI | O-Member | Full Member | |
ES | O-Member | Full Member | |
SE | O-Member | Full Member | |
CH | O-Member | Full Member | |
TR | O-Member | Full Member | |
UA | O-Member | Full Member | |
GB | P-Member | Full Member | |
US | P-Member | Full Member |
Facts and figures
Secretariat | Japan |
|---|---|
Participating countries | 11 |
Observer Countries | 20 |
TC 91 Officers
Chair | Mr Udo Welzel (DE) Term of office : 2024-06 | |
|---|---|---|
Secretary | Mr Masahide Okamoto (JP) |
IEC Central Office Contacts
Technical Officer | Ms Suzanne Yap | |
|---|---|---|
Standards Project Administrator | Ms Poh Luan Teo | |
Editor | Mr Leon Morsley |
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TC 91 Liaisons
Committee |
Description |
Incoming liaison representative |
Outgoing liaison representative |
|---|---|---|---|
| Internal IEC Liaison | |||
| SC 3C | Graphical symbols for use on equipment | Mr Arto Sirviö |
|
| TC 40 | Capacitors and resistors for electronic equipment | Mr Masahiro Tambo |
|
| TC 47 | Semiconductor devices | ||
| SC 47A | Integrated circuits | Mr Yoshinori FUKUBA |
|
| SC 47D | Semiconductor devices packaging | Mr Stephen Tisdale |
|
| SC 47E | Discrete semiconductor devices | ||
| SC 48B | Electrical connectors | ||
| TC 49 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection | ||
| TC 51 | Magnetic components, ferrite and magnetic powder materials | ||
| TC 86 | Fibre optics | Mr Hideo ITOH |
|
| TC 104 | Environmental conditions, classification and methods of test | ||
| TC 107 | Process management for avionics | ||
| TC 111 | Environmental standardization for electrical and electronic products and systems | Mr Douglas Sober | |
| TC 119 | Printed Electronics | ||
| TC 124 | Wearable electronic devices and technologies | ||
| ISO/IEC JTC 1/SC 41 | Internet of things and related technologies | ||
| Liaison ISO | |||
| ISO/TC 44/SC 12 | Soldering materials | ||
| ISO/TC 69/SC 5 | Acceptance sampling | ||
TC 91 Working Groups Liaisons
|
Working Groups
|
Description
|
Organization
|
Incoming liaison representative
|
Outgoing liaison representative
|
|---|---|---|---|---|
| Liaison C | ||||
| WG 1 |
Requirements for electronic components
|
IPC | ||
| WG 1 |
Requirements for electronic components
|
EDIFICE |
Mr Rainer Schrundner
|
|
| WG 1 |
Requirements for electronic components
|
JEITA | ||
| WG 2 |
Requirements for electronics assemblies
|
JEITA | ||
| WG 2 |
Requirements for electronics assemblies
|
IPC | ||
| WG 3 |
Measuring and test methods for electronics assemblies
|
IPC | ||
| WG 3 |
Measuring and test methods for electronics assemblies
|
JEITA | ||
| WG 4 |
Printed boards and materials
|
JEITA | ||
| WG 4 |
Printed boards and materials
|
IPC | ||
| WG 5 |
Terms and definitions
|
JEITA | ||
| WG 5 |
Terms and definitions
|
IPC | ||
| WG 10 |
Measuring and test methods for printed boards and printed board materials
|
JEITA | ||
| WG 10 |
Measuring and test methods for printed boards and printed board materials
|
IPC | ||
| WG 12 |
Design methodology and data transfer of circuit boards and circuit board assemblies
|
JEITA | ||
| WG 12 |
Design methodology and data transfer of circuit boards and circuit board assemblies
|
IPC | ||