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TC 47

Semiconductor devices
 
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TC 47 Subcommittee(s) and/or Working Group(s)

Label
Title
Subcommittees
SC 47AIntegrated circuits
SC 47DSemiconductor devices packaging
SC 47EDiscrete semiconductor devices
SC 47FMicro-electromechanical systems
Working Group
WG 1Terminology
WG 2Semiconductor Device Test Methods and Guidelines - Mechanical, Climatic and Storage
WG 5Wafer Level Reliability for semiconductor devices
WG 6Incubating Working Group
WG 7Semiconductor devices for energy conversion and transfer
WG 8Wide bandgap technologies – Power electronic conversion
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TC 47 Membership

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Austria
AT
P-Member
Full Member
Belarus
BY
O-Member
Full Member
Belgium
BE
P-Member
Full Member
Brazil
BR
O-Member
Full Member
Bulgaria
BG
O-Member
Full Member
China
CN
P-Member
Full Member
Czech Republic
CZ
O-Member
Full Member
Denmark
DK
O-Member
Full Member
Finland
FI
O-Member
Full Member
France
FR
P-Member
Full Member
Germany
DE
P-Member
Full Member
Hungary
HU
O-Member
Full Member
India
IN
O-Member
Full Member
Iran
IR
O-Member
Full Member
Ireland
IE
O-Member
Full Member
Israel
IL
P-Member
Full Member
Italy
IT
P-Member
Full Member
Japan
JP
P-Member
Full Member
Korea, Republic of
KR
P-Member
Full Member
Netherlands
NL
P-Member
Full Member
Norway
NO
O-Member
Full Member
Pakistan
PK
P-Member
Full Member
Philippines, Rep. of the
PH
O-Member
Full Member
Poland
PL
O-Member
Full Member
Romania
RO
O-Member
Full Member
Russian Federation
RU
P-Member
Full Member
Serbia
RS
O-Member
Full Member
Singapore
SG
P-Member
Full Member
Spain
ES
O-Member
Full Member
Sweden
SE
O-Member
Full Member
Switzerland
CH
O-Member
Full Member
Thailand
TH
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Turkey
TR
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Ukraine
UA
O-Member
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United Kingdom
GB
P-Member
Full Member
United States of America
US
P-Member
Full Member

Facts and figures

Secretariat
Korea, Republic of
Participating countries
15
Observer Countries
21
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TC 47 Officers

Chair
Mr Bob Mitchell (US)
Term of office : 2024-08

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Secretary
Mr Cheolung Cha (KR)

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Assistant Secretary
Mr Deok-kee Kim (KR)

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Assistant Secretary
Mr Namsu Kim (KR)

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IEC Central Office Contacts

Technical Officer
Ms Suzanne Yap

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Standards Project Administrator
Ms Poh Luan Teo

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Editor
Ms Esther Monnet

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TC 47 Liaisons

Committee
Description
Incoming liaison representative
Outgoing liaison representative
Internal IEC Liaison
TC 56DependabilityMr Jeff A. Jones
 Mr Nicholas (Nick) E Lycoudes
TC 91Electronics assembly technology Mr Jim Lynch
TC 101ElectrostaticsMr Reinhold Gärtner
 Mr Jim Lynch
TC 107Process management for avionicsMr Graham Goring
 Mr Jim Lynch
TC 110Electronic displays Mr Sung-Hoon Choa
TC 111Environmental standardization for electrical and electronic products and systems Mr Stephen Tisdale
TC 113Nanotechnology for electrotechnical products and systems Mr Joonho Bae
TC 119Printed Electronics Mr Hojun Ryu
TC 124Wearable electronic devices and technologiesMr Deok-kee Kim
 Mr Deok-kee Kim
Liaison ISO
ISO/TC/22/SC31Data communication Mr Werner Berns
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TC 47 Working Groups Liaisons

Working Groups
Description
Organization
Incoming liaison representative
Outgoing liaison representative
Liaison C
WG 1
Terminology
 EIA
WG 2
Semiconductor Device Test Methods and Guidelines - Mechanical, Climatic and Storage
 EIA
WG 5
Wafer Level Reliability for semiconductor devices
 EIA