TC 40 |
Capacitors and resistors for electronic equipment |
TC 40 Subcommittee(s) and/or Working Group(s)
Label |
Title |
|---|---|
| Working Groups | |
| WG 36 | Packaging of components for automatic handling |
| WG 39 | General items and harmonization |
| WG 40 | Capacitors, Inductors and Filters |
| WG 41 | Resistors |
| WG 43 | Non-linear Resistors |
| Project Teams | |
| PT 60286-3-3 | Packaging of components for automatic handling – Part 3-3: Packaging of surface mount components on continuous paper tapes for Auto Loading Feeder |
| PT 60286-3-4 | Packaging of components for automatic handling – Part 3-4: Packaging of surface mount components on continuous embossed tapes for Auto Loading Feeder |
| Maintenance Teams | |
| MT 60115-1 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| MT 60115-2 | Fixed resistors for use in electronic equipment. Part 2: Sectional specification: Fixed low-power non-wirewound resistors |
| MT 60115-2-1 | Fixed resistors for use in electronic equipment - Part 2: Blank detail specification: Leaded fixed low power film resistors, Classification level G |
| MT 60115-4 | Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Fixed power resistors |
| MT 60115-8 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount (SMD) resistors |
| MT 60286-1 | Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes |
| MT 60286-2 | Packing of components for automatic handling - Part 2: Tape packing of components with unidirectional leads on continuous tapes. |
| MT 60286-3 | Packing of components for automatic handling - Part 3: Packing of surface mount components on continuous tapes |
| MT 60286-5 | Packaging of components for automatic handling - Part 5: Matrix trays |
| MT 60384-1 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
| MT 60384-2 | Fixed capacitors for use in electronic equipment - Part 2: Sectional specification: Fixed metallized polyethylene terephthalate film dielectric d.c. capacitors |
| MT 60384-11 | Fixed capacitors for use in electronic equipment - Part 11: Sectional specification - Fixed polyethylene terephthalate film dielectric metal foil d.c. capacitors |
| MT 60384-13 | Fixed capacitors for use in electronic equipment - Part 13: Sectional specification - Fixed polypropylene film dielectric metal foil d.c. capacitors |
| MT 60384-14 | Electromagnetic interference suppression capacitors |
| MT 60384-15 | Fixed capacitors for use in electronic equipment. Part 15: Sectional specification: Fixed tantalum capacitors with non-solid or solid electrolyte |
| MT 60384-16 | Fixed capacitors for use in electronic equipment - Part 16: Sectional specification: Fixed metallized polypropylene film dielectric d.c. capacitors |
| MT 60384-17 | Fixed capacitors for use in electronic equipment - Part 17: Sectional specification: Fixed metallized polypropylene film dielectric a.c. and pulse capacitors |
| MT 60384-19 | Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed surface mount metallized polyethylene-terephthalate film dielectric d.c. capacitors, Ed. 2.0 |
| MT 60384-20 | Fixed capacitors for use in electronic equipment - Part 20: Sectional specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors |
| MT 60384-21 | Fixed capacitors for use in electronic equipment - Part 21: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 |
| MT 60384-22 | Fixed capacitors for use in electronic equipment - Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 |
| MT 60384-23 | Part 23:Fixed metallized polyethylene naphthalate film dielectric chip d.c. capacitors |
| MT 60384-24 | Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte |
| MT 60384-25 | Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
| MT 60384-26 | Fixed capacitors for use in electronic equipment - Part 26: Sectional specification - Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte |
| MT 60393-3 | Potentiometers for use in electronic equipment - Part 3: Sectional specification: Rotary precision potentiometers |
| MT 60393-4 | Potentiometers for use in electronic equipment - Part 4: Sectional specification: Single-turn rotary power potentiometers |
| MT 60539-1 | Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
| MT 60539-2 | Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors |
| MT 60738-1 | Thermistors |
| MT 60938-1 | Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification |
| MT 60938-2 | Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification |
| MT 60938-2-1 | Fixed inductors for electromagnetic interferencesuppression - Part 2-1: Blank detail specification - Inductors for which safety tests are required. Assessment level D |
| MT 60938-2-2 | Fixed inductors for electromagnetic interference suppression - Part 2-2: Blank detail specification - Inductors for which safety tests are required (only) |
| MT 60939-3 | Passive filter units for electromagnetic interference suppression - Part 3: Passive filter units for which safety tests are appropriate |
| MT 60940 | Guidance information on the application of capacitors, resistors, inductors and complete filter units for electromagnetic interference suppression |
| MT 61051-1 | Varistors for use in electronic equipment - Part 1: Generic specification |
| MT 61051-2 | Varistors for use in electronic equipment - Part 2: Sectional specification for surge suppression varistors |
| MT 62391-1 | Fixed electric double-layer capacitors for use in electronic equipment - Part 1: Generic specification |
| Joint Working Groups | |
| JWG 13 | Packaging systems used in electronic manufacturing Managed by TC 101 |
| Advisory Groups | |
| AG 42 | TC 40 website |
TC 40 Membership
 Country | Country Code  | P/O Status | IEC Membership |
|---|---|---|---|
AT | O-Member | Full Member | |
BE | P-Member | Full Member | |
BG | O-Member | Full Member | |
CN | P-Member | Full Member | |
CZ | O-Member | Full Member | |
DK | O-Member | Full Member | |
FI | P-Member | Full Member | |
FR | P-Member | Full Member | |
DE | P-Member | Full Member | |
HU | O-Member | Full Member | |
IN | P-Member | Full Member | |
IR | O-Member | Full Member | |
IE | O-Member | Full Member | |
IT | P-Member | Full Member | |
JP | P-Member | Full Member | |
KR | P-Member | Full Member | |
NL | P-Member | Full Member | |
NO | O-Member | Full Member | |
PL | O-Member | Full Member | |
PT | O-Member | Full Member | |
RO | O-Member | Full Member | |
RU | P-Member | Full Member | |
RS | O-Member | Full Member | |
ES | O-Member | Full Member | |
SE | P-Member | Full Member | |
CH | P-Member | Full Member | |
TH | O-Member | Full Member | |
UA | O-Member | Full Member | |
GB | O-Member | Full Member | |
US | P-Member | Full Member |
Facts and figures
Secretariat | Netherlands |
|---|---|
Participating countries | 14 |
Observer Countries | 16 |
TC 40 Officers
Chair | Mr Walter Huck (DE) Term of office : 2024-01 | |
|---|---|---|
Secretary | Mr Ronald Drenthen (NL) |
IEC Central Office Contacts
Technical Officer | Ms Suzanne Yap | |
|---|---|---|
Standards Project Administrator | Ms Poh Luan Teo | |
Editor | Mr Leon Morsley |
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TC 40 Liaisons
Committee |
Description |
Incoming liaison representative |
Outgoing liaison representative |
|---|---|---|---|
| Internal IEC Liaison | |||
| TC 9 | Electrical equipment and systems for railways | Mr Toshiatsu SUZUKI |
Mr Toshiatsu SUZUKI |
| SC 34D | Luminaires | Mr Franco Rusnati |
Mr Toshiatsu SUZUKI |
| SC 37B | Components for low-voltage surge protection | Mr Michael Fluege | |
| SC 47A | Integrated circuits | Mr Yoshinori FUKUBA |
|
| SC 47D | Semiconductor devices packaging | Mr Alan Lucero |
Mr Walter Huck |
| TC 69 | Electrical power/energy transfer systems for electrically propelled road vehicles and industrial trucks | Mr Toshiatsu SUZUKI | |
| TC 91 | Electronics assembly technology | Mr Masahiro Tambo | |
| TC 101 | Electrostatics | Mr David Swenson |
Mr Walter Huck |
| TC 104 | Environmental conditions, classification and methods of test | Mr Kimmo B. Saarinen | |
| TC 108 | Safety of electronic equipment within the field of audio/video, information technology and communication technology | Mr Bob Griffin Mr Jos Remy |
Mr Geert Stevens |