SC 47D |
Semiconductor devices packaging |

Country | Country Code | P/O Status | IEC Membership |
---|---|---|---|
AT | P-Member | Full Member | |
BY | O-Member | Full Member | |
BE | P-Member | Full Member | |
CN | P-Member | Full Member | |
CZ | O-Member | Full Member | |
DK | O-Member | Full Member | |
FI | O-Member | Full Member | |
FR | O-Member | Full Member | |
DE | P-Member | Full Member | |
IR | O-Member | Full Member | |
IT | O-Member | Full Member | |
JP | P-Member | Full Member | |
KR | P-Member | Full Member | |
NL | O-Member | Full Member | |
PK | P-Member | Full Member | |
PL | O-Member | Full Member | |
PT | O-Member | Full Member | |
RO | O-Member | Full Member | |
RU | O-Member | Full Member | |
SG | P-Member | Full Member | |
ES | O-Member | Full Member | |
SE | O-Member | Full Member | |
CH | O-Member | Full Member | |
TH | O-Member | Full Member | |
UA | O-Member | Full Member | |
GB | O-Member | Full Member | |
US | P-Member | Full Member |
Facts and figures
Secretariat | Japan |
---|---|
Participating countries | 9 |
Observer Countries | 18 |
Chair | Mr Stephen L Tisdale (US) Term of office : 2023-04 | |
---|---|---|
Secretary | Mr Hiroyoshi Yoshida (JP) |
IEC Central Office Contacts
Technical Officer | Ms Suzanne Yap | |
---|---|---|
Standards Project Administrator | Ms Poh Luan Teo | |
Editor | Ms Esther Monnet |
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Committee |
Description |
Incoming liaison representative |
Outgoing liaison representative |
---|---|---|---|
Internal IEC Liaison | |||
SC 3D | Classes, Properties and Identification of products - Common Data Dictionary (CDD) | Mr Addie Dijkstra |
Mr Hiroyoshi Yoshida |
TC 40 | Capacitors and resistors for electronic equipment | Mr Walter Huck |
Mr Alan Lucero |
SC 47A | Integrated circuits | Mr Yoshinori FUKUBA |
Mr Alan Lucero |
SC 65E | Devices and integration in enterprise systems | Mr Hiroyoshi Yoshida | |
TC 91 | Electronics assembly technology | Mr Stephen Tisdale |
Working Groups
|
Description
|
Organization
|
Incoming liaison representative
|
Outgoing liaison representative
|
---|---|---|---|---|
Liaison C | ||||
WG 1 |
Package outlines
|
JEITA | ||
WG 2 |
Terms, definitions, measuring methods and related requirement for semiconductor devices packaging
|
JEITA |
