International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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Other Documents SC 47D since 2019-10-22

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

91/1675/RVC

Result of Voting on 91/1578/CDV - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

2020-10-09 N
86C/1684/CDV

IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-09-11 2020-12-04 Y
91/1663/CDV

IEC 62878-2-602 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2020-09-11 2020-12-04 Y
25/700/CC

Compilation of Comments on 25/696/CD - IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-08-14 Y
86C/1682/CC

Compilation of Comments on 86C/1664/CD - IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-07-10 Y
91/1656/CC

Compilation of Comments on 91/1629/CD - IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2020-06-26 Y
25/695/RR

Review report on IEC 60027-1 Ed6: Letters symbols to be used in electrical technology - Part 1: General

2020-05-08 Y
25/696/CD

IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-05-08 2020-07-31 Y Report of Comments
111/577/RVD

Result of Voting on 111/573/FDIS - IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening - Fluorine, bromine and chlorine in polymer and electronics by combustion-ion chromatography (C-IC)

2020-04-17 N
86C/1663/RR

Review report on IEC 62148-21/Ed1: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-04-10 Y
86C/1664/CD

IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-04-10 2020-07-03 Y Report of Comments
111/573/FDIS

IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening - Fluorine, bromine and chlorine in polymer and electronics by combustion-ion chromatography (C-IC)

2020-02-28 2020-04-10 N Voting Result
91/1629/CD

IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2019-12-13 2020-03-06 Y Report of Comments
25/692/CD

ISO 80000-1 ED2: Quantities and units - Part 1: General

2019-11-29 2020-01-24 N Report of Comments