International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

Other Documents TC 91 since 2019-04-09

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

86/564/RVC

Result of Voting on 86/563/CDV - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector

2020-04-03 Y
47/2622/CD

IEC 63275-1 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2020-03-27 2020-06-19 Y
47/2623/CD

IEC 63275-2 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2020-03-27 2020-06-19 Y
47/2624/CD

IEC 63284 ED1: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-03-27 2020-06-19 Y
1/2432/RVC

Result of Voting on 1/2407/CDV - IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock

2020-03-20 N
64/2438/RR

Review report of IEC 60479-2 ED1: Effects of current on human beings and livestock - Part 2: Special aspects

2020-03-20 N
47/2619/RVC

Result of Voting on 47/2588/CDV - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-03-06 N
47/2620/CC

Compilation of Comments on 47/2599/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2020-03-06 N
109/183/FDIS

IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2020-02-28 2020-04-10 Y
111/573/FDIS

IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening - Fluorine, bromine and chlorine in polymer and electronics by combustion-ion chromatography (C-IC)

2020-02-28 2020-04-10 Y
47D/919/NP

PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-02-07 2020-05-01 U
64/2415/CDV

IEC 60364-5-54/AMD1 ED3: Amendment 1 - Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2020-01-17 2020-04-10 Y
47/2612/RVN

Result of Voting on 47/2578/NP - PNW 47-2578: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-01-03 Y
86/563/CDV

IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector

2020-01-03 2020-03-27 Y Voting Result
109/182/RVC

Result of Voting on 109/179/CDV - IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2019-12-27 Y
25/692/CD

ISO 80000-1 ED2: Quantities and units - Part 1: General

2019-11-29 2020-01-24 N Report of Comments
47/2607/RVC

Result of Voting on 47/2570/CDV - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-11-22 N
47/2605/RVN

Result of Voting on 47/2576A/NP - PNW 47-2576: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2019-11-15 Y
47/2606/RVN

Result of Voting on 47/2577A/NP - PNW 47-2577: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2019-11-15 Y
64/2407/RVC

Result of Voting on 64/2370/CDV - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-11-15 Y
86/557A/CC

Compilation of Comments on 86/553/CD - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-11-15 Y
47/2599/CD

IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2019-10-11 2020-01-03 N Report of Comments
47/2588/CDV

IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2019-09-27 2019-12-20 N Voting Result
47/2593/CC

Compilation of Comments on 47/2528/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

2019-09-20 N
111/552/RVC

Result of Voting on 111/514/CDV - IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening of fluorine, bromine and chlorine in polymer and electronics by Combustion-Ion Chromatography (C-IC)

2019-09-20 Y
111/553/RVD

Result of Voting on 111/536/FDIS - IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-09-20 Y
119/285/RVD

Result of Voting on 119/279/FDIS - IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary

2019-09-20 E
1/2407/CDV

IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock

2019-09-13 2019-11-29 N Voting Result
119/279/FDIS

IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary

2019-07-26 2019-09-06 E Voting Result
ACEA/266/DC

WORKING DRAFT FOR COMMENT: Guidelines for defining halogen content terminology in IEC publications

2019-07-19 2019-09-27 N/A Report of Comments
47/2576A/NP

PNW 47-2576: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2019-07-19 2019-08-09 Y Voting Result
47/2577A/NP

PNW 47-2577: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2019-07-19 2019-08-09 Y Voting Result
86/556/CC

Compilation of Comments on 86/549/CD - IEC 62496-2-61 ED1: Optical circuit boards - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits

2019-07-19 Y
1/2392A/CC

Compilation of Comments on 1/2358/CD - IEC 60050-195 ED2: International Electrotechnical Vocabulary - Part 195: Earthing and protection against electric shock

2019-07-12 N
111/536/FDIS

IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-07-05 2019-08-16 Y Voting Result
47/2570/CDV

IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-06-14 2019-09-06 N Voting Result
47/2562/CDV

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2019-05-24 2019-08-16 Y Voting Result
47/2578/NP

PNW 47-2578: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2019-05-17 2019-08-09 Y Voting Result
64/2370/CDV

IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-05-03 2019-07-26 Y Voting Result
107/356/RVDTR

Result of Voting on 107/351/DTR - IEC TR 63238-1 ED1: Process Management for Avionics – Electronics Design – Part 1: Interface Control Document (ICD)

2019-05-03 U
86/553/CD

IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-04-26 2019-07-19 Y Report of Comments
47/2567/CC

Compilation of Comments on 47/2527/CD - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2019-04-19 N
86/552/RVN

Result of Voting on 86/548/NP - PNW 86-548: Optical circuit boards - Part 4-xxx: Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-04-19 Y