International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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Other Documents SC 47D since 2018-11-13

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

111/554/RVC

Result of Voting on 111/515/CDV - IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)

2019-10-18 Y
86C/1615/RVC

Result of Voting on 86C/1596/CDV - IEC 62149-11 ED1: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2019-09-20 Y
91/1616/RVD

Result of Voting on 91/1597/FDIS - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

2019-09-20 Y
111/553/RVD

Result of Voting on 111/536/FDIS - IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-09-20 Y
91/1597/FDIS

IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

2019-08-02 2019-09-13 Y Voting Result
ACEA/266/DC

WORKING DRAFT FOR COMMENT: Guidelines for defining halogen content terminology in IEC publications

2019-07-19 2019-09-27 N/A Report of Comments
91/1589/RVC

Result of Voting on 91/1557/CDV - IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

2019-07-12 Y
101/589/Q

Withdrawal of IEC 61340-3-1 Ed. 2.0 and IEC 61340-3-2 Ed. 2.0

2019-07-05 2019-08-16 N/A Report of Comments
111/536/FDIS

IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-07-05 2019-08-16 Y Voting Result
91/1578/CDV

IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

2019-06-28 2019-09-20 N Voting Result
86C/1596/CDV

IEC 62149-11 ED1: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2019-06-21 2019-09-13 Y Voting Result
91/1580/RVD

Result of Voting on 91/1566/FDIS - IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

2019-05-17 Y
91/1577/RVC

Result of Voting on 91/1550/CDV - IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

2019-05-10 Y
86C/1593/CC

Compilation of Comments on 86C/1566/CD - IEC 62149-11 ED1: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2019-04-26 Y
86C/1586/RVD

Result of Voting on 86C/1574/FDIS - IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2019-04-12 Y
91/1575/RVN

Result of Voting on 91/1551/NP - PNW 91-1551: Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity

2019-04-12 U
91/1566/FDIS

IEC 60068-2-69/AMD1 ED3: Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

2019-03-29 2019-05-10 Y Voting Result
111/515/CDV

IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)

2019-03-22 2019-06-14 Y Voting Result
111/522/RVC

Result of Voting on 111/484/CDV - IEC 62959 ED1: Environmentally Conscious Design (ECD) - Principles, requirements and guidance

2019-03-22 Y
91/1557/CDV

IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

2019-03-15 2019-06-07 Y Voting Result
18/1669/CC

Compilation of Comments on 18/1645/CD - IEC 60092-304 ED4: Electrical installations in ships - Part 304: Equipment - Semiconductor convertors

2019-03-08 E
86C/1577/RVD

Result of Voting on 86C/1571/FDIS - IEC 62148-21 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2019-02-22 Y
86C/1574/FDIS

IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2019-02-15 2019-03-29 Y Voting Result
91/1559/RVDTR

Result of Voting on 91/1553/DTR - IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

2019-02-15 U
91/1550/CDV

IEC 62878-1 ED1: Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

2019-01-11 2019-04-05 Y Voting Result
86C/1571/FDIS

IEC 62148-21 ED1: Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2019-01-04 2019-02-15 Y Voting Result
91/1553/DTR

IEC TR 62878-2-7 ED1: Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

2018-12-14 2019-02-08 U Voting Result
86C/1566/CD

IEC 62149-11 ED1: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2018-11-23 2019-02-15 Y Report of Comments
91/1549/CC

Compilation of Comments on 91/1522/CD - IEC 62878-2-5 ED1: Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

2018-11-23 Y
91/1551/NP

PNW 91-1551: Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity

2018-11-23 2019-01-18 U Voting Result
86C/1557/RVC

Result of Voting on 86C/1515/CDV - IEC 62148-19 ED1: Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

2018-11-16 Y
86C/1559/CC

Compilation of Comments on 86C/1519/CD - IEC 62149-11 ED1: Fibre optic active components and devices – Performance standards – Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

2018-11-16 Y