International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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Other Documents TC 91 since 2019-10-22

Reference, Title
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Date

Closing

Date

CENELEC

Voting /

Comment

47D/921/RVN

Result of Voting on 47D/919/NP - PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-10-02 U
1/2446/FDIS

IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock

2020-09-11 2020-10-23 N
25/700/CC

Compilation of Comments on 25/696/CD - IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-08-14 Y
86/570/CD

IEC 62496-2-61 ED1: Optical circuit boards - Basic test and measurement procedures - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits

2020-08-14 2020-10-09 Y Report of Comments
SyCSM/46/RVDTR

Result of Voting on SyCSM/42/DTR - ISO/IEC TR 63306-1 ED1: Smart Manufacturing Standards Map (SM2) Part 1 : Framework

2020-08-07 U
86/565/NP

PNW 86-565:

Optical circuit boards - Part 4-21X: Interface standards - Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector intermateable with 250 μm pitch MPO 16

2020-07-17 2020-10-09 U Voting Result
47/2644/RVD

Result of Voting on 47/2633/FDIS - IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-07-10 Y
47/2637/RVD

Result of Voting on 47/2627/FDIS - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

2020-06-26 N
47/2638/RVD

Result of Voting on 47/2628/FDIS - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-06-26 N
64/2438A/RR

Revised review report of IEC 60479-2 ED1: Effects of current on human beings and livestock - Part 2: Special aspects

2020-05-29 N
64/2450/CD

IEC 60479-2 ED2: Effects of current on human beings and livestock - Part 2: Special aspects

2020-05-29 2020-07-24 N Report of Comments
47/2633/FDIS

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-05-22 2020-07-03 Y Voting Result
25/695/RR

Review report on IEC 60027-1 Ed6: Letters symbols to be used in electrical technology - Part 1: General

2020-05-08 Y
25/696/CD

IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-05-08 2020-07-31 Y Report of Comments
47/2621/CDV

IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2020-05-01 2020-07-24 N Voting Result
47/2627/FDIS

IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET

2020-05-01 2020-06-12 N Voting Result
47/2628/FDIS

IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-05-01 2020-06-12 N Voting Result
47/2629/RVC

Result of Voting on 47/2562/CDV - IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2020-05-01 Y
109/186/RVD

Result of Voting on 109/183/FDIS - IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2020-04-24 Y
47/2625/RR

Review report of IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

2020-04-17 Y
111/577/RVD

Result of Voting on 111/573/FDIS - IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening - Fluorine, bromine and chlorine in polymer and electronics by combustion-ion chromatography (C-IC)

2020-04-17 N
SyCSM/42/DTR

ISO/IEC TR 63306-1 ED1: Smart Manufacturing Standards Map (SM2) Part 1 : Framework

2020-04-17 2020-06-12 U Voting Result
86/564/RVC

Result of Voting on 86/563/CDV - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector

2020-04-03 Y
47/2622/CD

IEC 63275-1 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2020-03-27 2020-06-19 Y Report of Comments
47/2623/CD

IEC 63275-2 ED1: Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2020-03-27 2020-06-19 Y Report of Comments
47/2624/CD

IEC 63284 ED1: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-03-27 2020-06-19 Y Report of Comments
1/2432/RVC

Result of Voting on 1/2407/CDV - IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock

2020-03-20 N
47/2619/RVC

Result of Voting on 47/2588/CDV - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2020-03-06 N
47/2620/CC

Compilation of Comments on 47/2599/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2020-03-06 N
109/183/FDIS

IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2020-02-28 2020-04-10 Y Voting Result
111/573/FDIS

IEC 62321-3-2 ED2: Determination of certain substances in electrotechnical products - Part 3-2: Screening - Fluorine, bromine and chlorine in polymer and electronics by combustion-ion chromatography (C-IC)

2020-02-28 2020-04-10 N Voting Result
47D/919/NP

PNW 47D-919: Part model guideline for electronic-device packages – Part 1: XML requirements

2020-02-07 2020-05-01 U Voting Result
64/2415/CDV

IEC 60364-5-54/AMD1 ED3: Amendment 1 - Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2020-01-17 2020-04-10 Y Voting Result
47/2612/RVN

Result of Voting on 47/2578/NP - PNW 47-2578: Semiconductor devices - Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors

2020-01-03 Y
86/563/CDV

IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel symmetric PMT connector

2020-01-03 2020-03-27 Y Voting Result
109/182/RVC

Result of Voting on 109/179/CDV - IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2019-12-27 Y
25/692/CD

ISO 80000-1 ED2: Quantities and units - Part 1: General

2019-11-29 2020-01-24 N Report of Comments
47/2607/RVC

Result of Voting on 47/2570/CDV - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-11-22 N
47/2605/RVN

Result of Voting on 47/2576A/NP - PNW 47-2576: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

2019-11-15 Y
47/2606/RVN

Result of Voting on 47/2577A/NP - PNW 47-2577: Semiconductor devices - Reliability test method for silicon carbide descrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation by body diode operating

2019-11-15 Y
64/2407/RVC

Result of Voting on 64/2370/CDV - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-11-15 Y
86/557A/CC

Compilation of Comments on 86/553/CD - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-11-15 Y