International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

Other Documents TC 91 since 2018-12-09

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

25/692/CD

ISO 80000-1 ED2: Quantities and units - Part 1: General

2019-11-29 2020-01-24 N
47/2607/RVC

Result of Voting on 47/2570/CDV - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-11-22 N
64/2407/RVC

Result of Voting on 64/2370/CDV - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-11-15 Y
86/557A/CC

Compilation of Comments on 86/553/CD - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-11-15 Y
111/554/RVC

Result of Voting on 111/515/CDV - IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)

2019-10-18 Y
47/2599/CD

IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate

2019-10-11 2020-01-03 N
47/2588/CDV

IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2019-09-27 2019-12-20 N
47/2593/CC

Compilation of Comments on 47/2528/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

2019-09-20 N
111/553/RVD

Result of Voting on 111/536/FDIS - IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-09-20 Y
119/285/RVD

Result of Voting on 119/279/FDIS - IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary

2019-09-20 E
1/2407/CDV

IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock

2019-09-13 2019-11-29 N Voting Result
119/279/FDIS

IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary

2019-07-26 2019-09-06 E Voting Result
ACEA/266/DC

WORKING DRAFT FOR COMMENT: Guidelines for defining halogen content terminology in IEC publications

2019-07-19 2019-09-27 N/A Report of Comments
86/556/CC

Compilation of Comments on 86/549/CD - IEC 62496-2-61 ED1: Optical circuit boards - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits

2019-07-19 Y
1/2392A/CC

Compilation of Comments on 1/2358/CD - IEC 60050-195 ED2: International Electrotechnical Vocabulary - Part 195: Earthing and protection against electric shock

2019-07-12 N
111/536/FDIS

IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance

2019-07-05 2019-08-16 Y Voting Result
47/2570/CDV

IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET

2019-06-14 2019-09-06 N Voting Result
47/2562/CDV

IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2019-05-24 2019-08-16 Y Voting Result
64/2370/CDV

IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-05-03 2019-07-26 Y Voting Result
107/356/RVDTR

Result of Voting on 107/351/DTR - IEC TR 63238-1 ED1: Process Management for Avionics – Electronics Design – Part 1: Interface Control Document (ICD)

2019-05-03 U
86/553/CD

IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-04-26 2019-07-19 Y Report of Comments
47/2567/CC

Compilation of Comments on 47/2527/CD - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

2019-04-19 N
86/552/RVN

Result of Voting on 86/548/NP - PNW 86-548: Optical circuit boards - Part 4-xxx: Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-04-19 Y
47/2560/RR

Review report of IEC 60749-30 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2019-04-05 Y
47/2554/RVD

Result of Voting on 47/2539/FDIS - IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

2019-03-22 Y
111/515/CDV

IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)

2019-03-22 2019-06-14 Y Voting Result
111/522/RVC

Result of Voting on 111/484/CDV - IEC 62959 ED1: Environmentally Conscious Design (ECD) - Principles, requirements and guidance

2019-03-22 Y
47/2553/RVD

Result of Voting on 47/2538/FDIS - IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

2019-03-15 Y
107/351/DTR

IEC TR 63238-1 ED1: Process Management for Avionics – Electronics Design – Part 1: Interface Control Document (ICD)

2019-03-01 2019-04-26 U Voting Result
109/179/CDV

IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests

2019-02-22 2019-05-17 Y Voting Result
47/2544/CC

Compilation of Comments on 47/2502/CD - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) - Part 1: Fast BTI Test method

2019-02-15 N
64/2365/CC

Compilation of Comments on 64/2332/CD - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors

2019-02-01 Y
47/2538/FDIS

IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

2019-01-25 2019-03-08 Y Voting Result
47/2539/FDIS

IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

2019-01-25 2019-03-08 Y Voting Result
86/550/RVD

Result of Voting on 86/547/FDIS - IEC 62496-4-1 ED1: Optical circuit boards - Part 4-1: Interface standards – Terminated waveguide OCB assembly using single-row twelve-channel PMT connectors

2019-01-25 Y
119/252/RVC

Result of Voting on 119/212/CDV - IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary

2019-01-18 E
86/548/NP

PNW 86-548: Optical circuit boards - Part 4-xxx: Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector

2019-01-11 2019-04-05 Y Voting Result
86/549/CD

IEC 62496-2-61 ED1: Optical circuit boards - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits

2019-01-11 2019-04-05 Y Report of Comments
109/178/CC

Compilation of Comments on 109/166A/CD - IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests (Proposed horizontal standard)

2019-01-04 Y