International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |

Reference, Title
|
Downloads
|
Circulation Date |
Closing Date |
CENELEC
|
Voting / Comment |
---|---|---|---|---|---|
25/692/CD
ISO 80000-1 ED2: Quantities and units - Part 1: General
|
2019-11-29 | 2020-01-24 | N | ||
47/2607/RVC
Result of Voting on 47/2570/CDV - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET
|
2019-11-22 | N | |||
64/2407/RVC
Result of Voting on 64/2370/CDV - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors
|
2019-11-15 | Y | |||
86/557A/CC
Compilation of Comments on 86/553/CD - IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector
|
2019-11-15 | Y | |||
111/554/RVC
Result of Voting on 111/515/CDV - IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)
|
2019-10-18 | Y | |||
47/2599/CD
IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial film on silicon carbide substrate
|
2019-10-11 | 2020-01-03 | N | ||
47/2588/CDV
IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence
|
2019-09-27 | 2019-12-20 | N | ||
47/2593/CC
Compilation of Comments on 47/2528/CD - IEC 63229 ED1: Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate
|
2019-09-20 | N | |||
111/553/RVD
Result of Voting on 111/536/FDIS - IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance
|
2019-09-20 | Y | |||
119/285/RVD
Result of Voting on 119/279/FDIS - IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary
|
2019-09-20 | E | |||
1/2407/CDV
IEC 60050-195 ED2: International Electrotechnical Vocabulary (IEV) - Part 195: Earthing and protection against electric shock
|
2019-09-13 | 2019-11-29 | N | Voting Result | |
119/279/FDIS
IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary
|
2019-07-26 | 2019-09-06 | E | Voting Result | |
ACEA/266/DC
WORKING DRAFT FOR COMMENT: Guidelines for defining halogen content terminology in IEC publications
|
2019-07-19 | 2019-09-27 | N/A | Report of Comments | |
86/556/CC
Compilation of Comments on 86/549/CD - IEC 62496-2-61 ED1: Optical circuit boards - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits
|
2019-07-19 | Y | |||
1/2392A/CC
Compilation of Comments on 1/2358/CD - IEC 60050-195 ED2: International Electrotechnical Vocabulary - Part 195: Earthing and protection against electric shock
|
2019-07-12 | N | |||
111/536/FDIS
IEC 62430 ED2: Environmentally conscious design (ECD) - Principles, requirements and guidance
|
2019-07-05 | 2019-08-16 | Y | Voting Result | |
47/2570/CDV
IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI Test for MOSFET
|
2019-06-14 | 2019-09-06 | N | Voting Result | |
47/2562/CDV
IEC 60749-30 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
|
2019-05-24 | 2019-08-16 | Y | Voting Result | |
64/2370/CDV
IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors
|
2019-05-03 | 2019-07-26 | Y | Voting Result | |
107/356/RVDTR
Result of Voting on 107/351/DTR - IEC TR 63238-1 ED1: Process Management for Avionics – Electronics Design – Part 1: Interface Control Document (ICD)
|
2019-05-03 | U | |||
86/553/CD
IEC 62496-4-214 ED1: Optical circuit boards - Part 4-214: Interface standards – Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector
|
2019-04-26 | 2019-07-19 | Y | Report of Comments | |
47/2567/CC
Compilation of Comments on 47/2527/CD - IEC 63068-3 ED1: Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence
|
2019-04-19 | N | |||
86/552/RVN
Result of Voting on 86/548/NP - PNW 86-548: Optical circuit boards - Part 4-xxx: Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector
|
2019-04-19 | Y | |||
47/2560/RR
Review report of IEC 60749-30 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
|
2019-04-05 | Y | |||
47/2554/RVD
Result of Voting on 47/2539/FDIS - IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
|
2019-03-22 | Y | |||
111/515/CDV
IEC 62321-10 ED1: Determination of certain substances in electrotechnical products - Part 10: Polycyclic aromatic hydrocarbons (PAHs) in polymers and electronics by gas chromatography-mass spectrometry (GC-MS)
|
2019-03-22 | 2019-06-14 | Y | Voting Result | |
111/522/RVC
Result of Voting on 111/484/CDV - IEC 62959 ED1: Environmentally Conscious Design (ECD) - Principles, requirements and guidance
|
2019-03-22 | Y | |||
47/2553/RVD
Result of Voting on 47/2538/FDIS - IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
|
2019-03-15 | Y | |||
107/351/DTR
IEC TR 63238-1 ED1: Process Management for Avionics – Electronics Design – Part 1: Interface Control Document (ICD)
|
2019-03-01 | 2019-04-26 | U | Voting Result | |
109/179/CDV
IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests
|
2019-02-22 | 2019-05-17 | Y | Voting Result | |
47/2544/CC
Compilation of Comments on 47/2502/CD - IEC 62373-1 ED1: Semiconductor devices – Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) - Part 1: Fast BTI Test method
|
2019-02-15 | N | |||
64/2365/CC
Compilation of Comments on 64/2332/CD - IEC 60364-5-54/AMD1 ED3: Low-voltage electrical installations - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements and protective conductors
|
2019-02-01 | Y | |||
47/2538/FDIS
IEC 60749-17 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
|
2019-01-25 | 2019-03-08 | Y | Voting Result | |
47/2539/FDIS
IEC 60749-18 ED2: Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
|
2019-01-25 | 2019-03-08 | Y | Voting Result | |
86/550/RVD
Result of Voting on 86/547/FDIS - IEC 62496-4-1 ED1: Optical circuit boards - Part 4-1: Interface standards – Terminated waveguide OCB assembly using single-row twelve-channel PMT connectors
|
2019-01-25 | Y | |||
119/252/RVC
Result of Voting on 119/212/CDV - IEC 62899-101 ED1: Printed Electronics - Part 101: Terminology - Vocabulary
|
2019-01-18 | E | |||
86/548/NP
PNW 86-548: Optical circuit boards - Part 4-xxx: Terminated waveguide OCB assembly using a single-row thirty-two-channel PMT connector
|
2019-01-11 | 2019-04-05 | Y | Voting Result | |
86/549/CD
IEC 62496-2-61 ED1: Optical circuit boards - Part 2-61: Test methods - Flexibility for flexible optic-electric circuits
|
2019-01-11 | 2019-04-05 | Y | Report of Comments | |
109/178/CC
Compilation of Comments on 109/166A/CD - IEC 60664-1 ED3: Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requirements and tests (Proposed horizontal standard)
|
2019-01-04 | Y |
