SC 47D

Semiconductor devices packaging

 
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Other Documents SC 47D since 2020-04-18

Reference, Title
Downloads

Circulation

Date

Closing

Date

CENELEC

Voting /

Comment

91/1720/RVC

Result of Voting on 91/1663/CDV - IEC 62878-2-602 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2021-03-12 Y
101/625/CD

IEC 61340-2-1/AMD1 ED2: Amendment 1 - Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge (Proposed horizontal standard)

2021-02-26 2021-05-21 Y
86C/1710/RVC

Result of Voting on 86C/1684/CDV - IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2021-02-05 Y
91/1706/NP

PNW 91-1706 ED1: Endurance test methods for die attach materials – Part 1: General specification

2021-01-29 2021-04-23 U
91/1707/NP

PNW 91-1707 ED1: Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

2021-01-29 2021-04-23 U
91/1709/NP

PNW 91-1709 ED1: Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

2021-01-29 2021-02-26 U Voting Result
91/1705/RVD

Result of Voting on 91/1688/FDIS - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

2021-01-22 N
101/623/RR

Review report of IEC 61340-2-1 Ed.2: Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge

2021-01-22 Y
91/1688/FDIS

IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

2020-12-04 2021-01-15 N Voting Result
8/1568/RR

Review report of IEC 60050-602 ED1: International Electrotechnical Vocabulary (IEV) - Part 602: Generation, transmission and distribution of electricity - Generation

2020-11-20 N
8/1569/RR

Review report of IEC 60050-603 ED1: International Electrotechnical Vocabulary (IEV) - Part 603: Generation, transmission and distribution of electricity - Power systems planning and management

2020-11-20 N
8/1570/RR

Review report of IEC 60050-605 ED1: International Electrotechnical Vocabulary (IEV) - Part 605: Generation, transmission and distribution of electricity - Substations

2020-11-20 N
8/1571/RR

Review reports of 60050-614 ED1: International Electrotechnical Vocabulary (IEV) - Part 614: Generation, transmission and distribution of electricity - Operation

2020-11-20 N
8/1572/RR

Review report of IEC 60050-617 ED1: International Electrotechnical Vocabulary (IEV) - Part 617: Organization/Market of electricity

2020-11-20 N
91/1675/RVC

Result of Voting on 91/1578/CDV - IEC 60194-1 ED1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

2020-10-09 N
86C/1684/CDV

IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-09-11 2020-12-04 Y Voting Result
91/1663/CDV

IEC 62878-2-602 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2020-09-11 2020-12-04 Y Voting Result
25/700/CC

Compilation of Comments on 25/696/CD - IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-08-14 Y
86C/1682/CC

Compilation of Comments on 86C/1664/CD - IEC 62148-21 ED2: Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

2020-07-10 Y
91/1656/CC

Compilation of Comments on 91/1629/CD - IEC 62878-2-601 ED1: Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

2020-06-26 Y
25/695/RR

Review report on IEC 60027-1 Ed6: Letters symbols to be used in electrical technology - Part 1: General

2020-05-08 Y
25/696/CD

IEC 80000-17 ED1: Quantities and units - Part 17: Time dependency

2020-05-08 2020-07-31 Y Report of Comments