TC 119 |
Printed Electronics |

Project Reference |
Document Reference |
Init. Date |
Current Stage |
Next Stage |
Working Group |
Project Leader |
Fcst. Publ. Date |
---|---|---|---|---|---|---|---|
PWI TR 119-13 ED1
Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink
|
PWI
2018-11 |
2021-11 |
WG 2 | Jinsoo Noh | |||
PWI 119-16
Future IEC 62899-505-2 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor
|
PWI
2018-12 |
prePNW
2021-03 |
|||||
PWI 119-17 ED1
Future IEC 62899-2XX-X: Space charge mobility measurement in organic diodes
|
PWI
2019-10 |
prePNW
2021-04 |
WG 2 | Fernando de Castro | |||
PWI TR 119-19 ED1
IEC TR 62899-3XX : Equipment – Substrate - Sheet to sheet mechanical dimension
|
PWI
2019-10 |
2020-11 |
WG 3 | Yoshiaki Kondoh | |||
PWI 119-22
Future IEC 62899-3XX ED1 Printed Electronics - Part 30X: Equipment – Sintering – Temperature uniformity measurement method for photonic sintering system
|
PWI
2020-11 |
prePNW
2021-04 |
Sang Ho Lee | ||||
PWI 119-23
Future IEC 62899-525-1 ED1 Printed electronics - Part 525-1: Quality Assessment - R2R printed NFC QR code label for anticounterfeiting
|
PWI
2020-11 |
prePNW
2021-04 |
Gyoujin Cho | ||||
PWI 119-24
Future IEC 62899-403-2 ED1 Printed electronics - Part 403-1: Printability - Requirements - for reproducibility - Basic patterns for plating
|
PWI
2020-11 |
prePNW
2021-04 |
Takehito Kozasa | ||||
PNW 119-339 ED1
IEC 62899-202-10 ED1 Printed Electronics Part 202-10 : Materials - Resistance measurement method on thermoformed conducting layer
|
119/339/NP |
PRVN
2021-02 |
2021-03 |
WG 2 | Outi Rusanen | 2023-11 | |
PNW 119-340 ED1
IEC 62899-302-4 ED1 Printed Electronics - Part 302-4 : Equipment - Inkjet – Media for inkjet printing drop position evaluation for printed electronics
|
119/340/NP |
PRVN
2021-02 |
2021-03 |
WG 3 | Kei Hyodo | 2024-12 | |
PNW 119-341 ED1
IEC 62899-507-1 ED1 Printed Electronicss - Part 507-1: Quality assessment - Printed electrode connection to wire
|
119/341/NP |
PRVN
2021-02 |
2021-03 |
WG 5 | Chae Min Lim | 2023-07 | |
IEC 62899-201-2 ED1
Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates
|
119/262/CDV | 2017-02 |
AFDIS
2020-06 |
DECFDIS
2021-04 |
WG 2 | Satoshi MAEDA | 2021-08 |
IEC 62899-202 ED2
Printed electronics - Part 202: Materials - Conductive ink
|
119/327/RR | 2020-10 |
ACD
2020-10 |
CD
2020-11 |
WG 2 | Tadanobu Sato | 2023-03 |
IEC 62899-202-4 ED1
Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers(conductive and insulating)
|
119/272/CDV | 2017-02 |
AFDIS
2020-08 |
DECFDIS
2021-04 |
WG 2 | Satoshi MAEDA | 2021-08 |
IEC 62899-202-8 ED1
IEC 62899-202-8 ED1 Printed electronics – Part 202-8: Materials – Conductive film – Measurement for difference in resistance with printing direction of conductive film fabricated with wire shaped materials
|
119/333/NP | 2021-02 |
ACD
2021-02 |
CD
2022-01 |
WG 2 | Haekyoung Kim | 2023-07 |
IEC 62899-202-9 ED1
IEC 62899-202-9 ED1 : Materials - Guidelines for printed patterns for mechanical test
|
119/335/CD | 2019-10 |
PCC
2021-02 |
2021-03 |
WG 2 | Byoung-Joon Kim | 2022-06 |
IEC 62899-203 ED2
Printed electronics - Part 203: Materials - Semiconductor ink
|
119/328/RR | 2020-10 |
ACD
2020-10 |
CD
2021-04 |
WG 2 | Simon Ogier | 2023-03 |
IEC 62899-301-3 ED1
Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of printing plate roller shape errors
|
119/337/CD | 2019-08 |
PCC
2021-02 |
2021-03 |
WG 3 | Dongwoo Kang | 2022-03 |
IEC TR 62899-302-5 ED1
IEC TR 62899-302-5: Equipment - Inkjet - Review Result of Measuring Methods for Inkjet Printing
|
119/324/CD | 2020-09 |
PCC
2020-12 |
2021-01 |
WG 3 | Kei Hyodo | 2021-12 |
IEC 62899-402-3 ED1
Printed Electronics – Part 402-3: Printability – Measurement of qualities – Voids in printed pattern using two-dimensional optical image
|
119/346/FDIS | 2019-03 |
CFDIS
2021-02 |
PRVD
2021-03 |
WG 4 | Chung-Hwan Kim | 2021-05 |
IEC TR 62899-402-4 ED1
Printed electronics - Part 402-4: Printability - Classification and measurement methods for morphology
|
119/300/DTR |
2020-01 |
PRVDTR
2020-03 |
2021-03 |
WG 4 | Tadahiro Furukawa | 2021-09 |
IEC 62899-503-3 ED1
Printed electronics- Part 503-3 : Quality assessment - Measuring method of contact resistance for the printed thin film transistor by transfer length method
|
119/299/CDV | 2019-03 |
AFDIS
2021-02 |
DECFDIS
2021-03 |
WG 5 | Takehito Kozasa | 2021-10 |
IEC 62899-506-1 ED1
Printed electronics-Part 506-1: Quality assessment- Accelerated stress test of printed heating element
|
119/338/CD | 2019-04 |
PCC
2021-02 |
2021-03 |
WG 5 | Chae Min Lim | 2022-02 |
IEC TR 62899-550-1 ED1
Future IEC TR 62899-550-1: Quality assessment - Framework document on durability testing
|
119/313/CD |
ADTR
2020-11 |
TDTR
2021-03 |
WG 5 | HYUN JONG KIM | 2021-12 |
