International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (27)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI TR 91-1

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

PWI
  • PWI
  • Preliminary Work Item

2018-12

2019-11

PNW 91-1590

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

91/1590/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2019-11

WG 4 Douglas Sober 2021-12
PNW 91-1593

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

91/1593/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2019-11

WG 10 2021-12
PNW 91-1594

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

91/1594/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2019-11

WG 10 Ying GE 2021-11
PNW 91-1617

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

91/1617/NP PNW
  • PNW
  • New Work Item Proposal

2019-10

PRVN
  • PRVN
  • Preparation of RVN document

2020-01

WG 10 Min-su Lee 2021-12
IEC 60068-2-20 ED6

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

91/1587/CD 2017-07 PCC
  • PCC
  • Preparation of CC

2019-10

2019-11

WG 3 Walter Huck 2021-02
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

91/1584/CD 2016-12 TCDV
  • TCDV
  • Translation of CDV

2019-11

CCDV
  • CCDV
  • Draft circulated as CDV

2019-12

WG 3 Walter Huck 2021-02
IEC 60194-1 ED1

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

91/1578/CDV 2017-08 PRVC
  • PRVC
  • Preparation of RVC

2019-09

2019-12

WG 5 Min-su Lee 2020-08
IEC 61188-6-1 ED1

Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

91/1554/CD 2018-01 ACDV
  • ACDV
  • Approved for CDV

2019-04

TCDV
  • TCDV
  • Translation of CDV

2020-01

WG 12 Rainer Taube 2020-12
IEC 61188-6-2 ED1

Circuit boards and circuit boards assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

91/1604/CD 2019-07 ACDV
  • ACDV
  • Approved for CDV

2019-11

TCDV
  • TCDV
  • Translation of CDV

2020-07

WG 12 Hiroyuki ISHIBASHI 2021-12
IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

91/1543/CD 2018-01 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2019-11

WG 10 Douglas Sober 2021-04
IEC 61189-2-803 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

91/1545/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2019-11

WG 10 Douglas Sober 2021-04
IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

91/1546/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2019-11

WG 10 Douglas Sober 2021-04
IEC 61189-5-301 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

91/1620/CD 2019-09 CD
  • CD
  • Draft circulated as CD

2019-11

PCC
  • PCC
  • Preparation of CC document

2020-01

WG 3 Kaichi Tsuruta 2021-12
IEC 61189-5-501 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

91/1569/CD 2018-10 CDM
  • CDM
  • CD to be discussed at meeting

2019-08

2019-11

WG 3 Graham Naisbitt 2022-05
IEC 61189-5-502 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

91/1571/CD 2019-04 CDM
  • CDM
  • CD to be discussed at meeting

2019-08

2019-11

WG 3 Graham Naisbitt 2021-06
IEC 61189-5-504 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

91/1579/CDV 2017-09 AFDIS
  • AFDIS
  • Approved for FDIS

2019-11

WG 3 Graham Naisbitt 2020-08
IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

91/1601/CDV 2015-11 CCDV
  • CCDV
  • Draft circulated as CDV

2019-09

PRVC
  • PRVC
  • Preparation of RVC

2019-12

WG 3 Shigeru SUGINO 2020-10
IEC TR 61191-7 ED1

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

91/1583/DTR

2019-05 TPUB
  • TPUB
  • Translation of publication

2019-10

DECPUB
  • DECPUB
  • Publication at Editing Check

2019-11

WG 1 2020-03
IEC 61249-6-3 ED1

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

91/1548/CD 2018-07 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2019-11

WG 4 Douglas Sober 2021-04
IEC 61760-1 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

91/1602/CDV 2017-04 CCDV
  • CCDV
  • Draft circulated as CDV

2019-09

PRVC
  • PRVC
  • Preparation of RVC

2019-12

WG 1 Udo Welzel 2020-12
IEC 61760-2 ED3

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

91/1586/RR 2019-07 ACD
  • ACD
  • Approved for CD

2019-07

CD
  • CD
  • Draft circulated as CD

2020-03

WG 1 Kimmo B. Saarinen 2022-03
IEC 61760-3 ED2

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

91/1588/CD 2019-04 PCC
  • PCC
  • Preparation of CC

2019-09

2019-10

WG 1 Tetsuji KAWAMATA 2021-06
IEC 62878-2-601 ED1

Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity

91/1551/NP 2019-04 ACD
  • ACD
  • Approved for CD

2019-04

CD
  • CD
  • Draft circulated as CD

2019-12

WG 6 Yoshihisa KATOH 2021-12
IEC 63215-2 ED1

Endurance test methods for die attach materials applied to power electronics devices – Part 1-1: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

91/1494/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2019-12

WG 3 Tsuyoshi YAMAMOTO 2021-12
IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

91/1497/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2019-12

WG 3 Tsuyoshi YAMAMOTO 2021-12
IEC 63251 ED1

Test Method for Mechanical Property of Flexible Optic-Electric Circuit Boards under Thermal Stress

91/1558/NP 2019-05 ACD
  • ACD
  • Approved for CD

2019-05

CD
  • CD
  • Draft circulated as CD

2019-12

WG 10 Young-Min Im 2021-12