TC 91

Electronics assembly technology

 
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TC 91 Work programme (33)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI TR 91-1 ED1

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

PWI
  • PWI
  • Preliminary work item

2018-12

2021-11

WG 3 Ichizo Sakamoto
PNW 91-1693 ED1

DEVICE EMBEDDING ASSEMBLY TECHNOLOGY – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

91/1693/NP PRVN
  • PRVN
  • Preparation of RVN

2021-02

2021-03

WG 6 Yoshihisa KATOH 2024-06
PNW 91-1706 ED1

Endurance test methods for die attach materials – Part 1: General specification

91/1706/NP PNW
  • PNW
  • New work item proposal

2021-01

PRVN
  • PRVN
  • Preparation of RVN

2021-04

WG 3 Yoshiharu Kariya 2023-11
PNW 91-1707 ED1

Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

91/1707/NP PNW
  • PNW
  • New work item proposal

2021-01

PRVN
  • PRVN
  • Preparation of RVN

2021-04

WG 3 Hiroyuki Takahashi 2023-11
PNW 91-1709 ED1

Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

91/1709/NP PRVN
  • PRVN
  • Preparation of RVN

2021-02

2021-03

WG 3 Hiroshi Nishikawa 2023-11
PNW 91-1710 ED1

Electrical test method of printed circuit board by measuring the capacitance

91/1710/NP PNW
  • PNW
  • New work item proposal

2021-02

PRVN
  • PRVN
  • Preparation of RVN

2021-05

WG 10 Hyun Ho Kim 2024-05
PNW 91-1718 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

prePNW
  • prePNW
  • Preparation of NP document

2021-03

PNW
  • PNW
  • New work item proposal

WG 10 2023-10
IEC 60068-2-20 ED6

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

91/1701/FDIS

2017-07 PRVD
  • PRVD
  • Preparation of RVD

2021-02

APUB
  • APUB
  • Approved for publication

2021-03

WG 3 Walter Huck 2021-04
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

91/1622/CDV 2016-12 AFDIS
  • AFDIS
  • Approved for FDIS

2020-11

DECFDIS
  • DECFDIS
  • FDIS at editing check

2021-03

WG 3 Walter Huck 2021-10
IEC 61188-6-3 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

91/1700/CD 2020-12 CD
  • CD
  • Draft circulated as CD

2021-01

PCC
  • PCC
  • Preparation of CC

2021-03

WG 12 Michael Schleicher 2022-12
IEC 61189-2-501 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

91/1661/CDV 2019-12 PRVC
  • PRVC
  • Preparation of RVC

2020-12

2021-02

WG 10 Ying GE 2021-10
IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

91/1543/CD 2018-01 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2022-04
IEC 61189-2-803 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

91/1545/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2022-04
IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

91/1546/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2022-04
IEC 61189-2-805 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

91/1696/CD 2020-05 CD
  • CD
  • Draft circulated as CD

2020-12

PCC
  • PCC
  • Preparation of CC

2021-03

WG 10 Min-su Lee 2022-08
IEC 61189-2-807 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

91/1697/CDV 2019-12 CCDV
  • CCDV
  • Draft circulated as CDV

2021-02

PRVC
  • PRVC
  • Preparation of RVC

2021-04

WG 10 yuan gao 2022-03
IEC 61189-2-808 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

91/1690/CD 2020-09 PCC
  • PCC
  • Preparation of CC

2021-02

2021-03

WG 10 Hyun Ho Kim 2023-10
IEC 61189-5-301 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

91/1655/CDV 2019-09 BPUB
  • BPUB
  • Being published

2021-03

PPUB
  • PPUB
  • Publication issued

2021-04

WG 3 Kaichi Tsuruta 2021-04
IEC TR 61191-8 ED1

Printed board assemblies – Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices

91/1665/DTR

2020-08 BPUB
  • BPUB
  • Being published

2021-03

PPUB
  • PPUB
  • Publication issued

2021-04

WG 2 Udo Welzel 2021-04
IEC 61249-6-3 ED1

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

91/1680/CDV 2018-07 CCDV
  • CCDV
  • Draft circulated as CDV

2020-12

PRVC
  • PRVC
  • Preparation of RVC

2021-03

WG 4 Douglas Sober 2022-01
IEC 61636 ED2

Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE Std 1636-2018)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC 61636-1 ED2

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML) (IEEE Std 1636.1-2018)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC 61691-6 ED2

Behavioural languages – Part 6: VHDL Analog and Mixed-Signal Extensions (IEEE Std 1076.1-2017)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC 61691-8 ED1

Behavioural languages – Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual (IEEE Std 1666.1-2016)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC 61760-2 ED3

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

91/1666/CDV 2019-07 APUB
  • APUB
  • Approved for publication

2021-01

2021-07

WG 1 Kimmo B. Saarinen 2021-11
IEC 62530 ED3

SystemVerilog - Unified Hardware Design, Specification, and Verification Language (IEEE Std 1800-2017)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC 62530-2 ED1

SystemVerilog – Part 2: Universal Verification Methodology Language Reference Manual (IEEE Std 1800.2-2017)

RFDIS
  • RFDIS
  • FDIS received and registered

2021-03

2021-05

2021-09
IEC TR 62878-2-8 ED1

Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

91/1649/DTR

2020-04 PRVDTR
  • PRVDTR
  • Preparation of RVDTR

2020-06

2021-01

WG 6 Min-su Lee 2021-09
IEC TR 62878-2-9 ED1

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

91/1703/DTR 2021-01 CDTR
  • CDTR
  • Draft circulated as DTR

2021-01

PRVDTR
  • PRVDTR
  • Preparation of RVDTR

2021-03

2021-11
IEC 62878-2-602 ED1

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

91/1663/CDV 2019-04 PRVC
  • PRVC
  • Preparation of RVC

2020-12

2021-02

WG 6 Yoshihisa KATOH 2021-10
IEC 63215-2 ED1

Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

91/1660/CD 2018-09 PCC
  • PCC
  • Preparation of CC

2020-10

2021-06

WG 3 Hiroshi Nishikawa 2022-04
IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

91/1497/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2021-12

WG 3 Yoshiharu Kariya 2022-04
IEC 63251 ED1

Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

91/1626/CD 2019-05 ACDV
  • ACDV
  • Approved for CDV

2020-11

TCDV
  • TCDV
  • Translation of CDV

2021-02

WG 10 Young-Min Im 2022-04