TC 91

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

DEVICE EMBEDDING ASSEMBLY TECHNOLOGY – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

Endurance test methods for die attach materials – Part 1: General specification

Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

Electrical test method of printed circuit board by measuring the capacitance

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

Behavioural languages – Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual (IEEE Std 1666.1-2016)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

SystemVerilog – Part 2: Universal Verification Methodology Language Reference Manual (IEEE Std 1800.2-2017)

Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress