SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (5)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62047-38 ED1

Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

47F/378/FDIS 2019-10 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2021-04

PRVD
  • PRVD
  • Preparation of RVD

2021-05

WG 2 Jae-Hyun Kim 2021-08
IEC 62047-40 ED1

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of Micro-electromechanical inertial shock switch threshold

47F/372/CDV 2019-10 AFDIS
  • AFDIS
  • Approved for FDIS

2021-05

DECFDIS
  • DECFDIS
  • FDIS at editing check

2021-09

WG 3 wei zhang 2022-04
IEC 62047-41 ED1

Semiconductor devices - Micro-electromechanical devices – Part 41: RF MEMS circulators and isolators

47F/376/FDIS 2019-10 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2021-04

PRVD
  • PRVD
  • Preparation of RVD

2021-05

WG 3 Wei Wang 2021-07
IEC 62047-42 ED1

Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever

47F/366/NP 2021-01 ACD
  • ACD
  • Approved for CD

2021-01

CD
  • CD
  • Draft circulated as CD

2021-06

WG 2 Isaku KANNO 2023-09
IEC 62047-43 ED1

Semiconductor devices – Micro-electromechanical devices – Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible electro-mechanical devices

47F/375/NP 2021-04 ACD
  • ACD
  • Approved for CD

2021-04

CD
  • CD
  • Draft circulated as CD

2021-11

WG 2 Nobuyuki Shishido 2024-03