Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-X: Test methods for materials for interconnection structures–Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Circuit boards and circuit boards assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Endurance test methods for die attach materials applied to power electronics devices – Part 1-1: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress