International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
export to xls file

SC 47F Work programme (2)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62047-35 ED1

Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

47F/320/CDV 2017-07 AFDIS
  • AFDIS
  • Approved for FDIS

2019-03

TFDIS
  • TFDIS
  • Translation of FDIS

2019-09

WG 2 Shoji Kamiya 2020-05
IEC 62047-37 ED1

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

47F/324/CD 2018-09 TCDV
  • TCDV
  • Translation of CDV

2019-05

CCDV
  • CCDV
  • Draft circulated as CDV

2019-07

WG 2 Isaku KANNO 2020-09