International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (6)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47F-340

Semiconductor devices - Micro-electromechanical devices - Part 39:Terms and definitions of Micro-electromechanical inertial shock switch

47F/340/NP PRVN
  • PRVN
  • Preparation of RVN

2019-09

2019-10

WG 3 wei zhang 2023-03
IEC 62047-35 ED1

Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

47F/344/FDIS 2017-07 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-09

PRVD
  • PRVD
  • Preparation of RVD document

2019-11

WG 2 Shoji Kamiya 2020-01
IEC 62047-37 ED1

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

47F/336/CDV 2018-09 PRVC
  • PRVC
  • Preparation of RVC

2019-10

2020-01

WG 2 Isaku KANNO 2020-09
IEC 62047-38 ED1

Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

47F/339/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-01

WG 2 Jae-Hyun Kim 2022-04
IEC 62047-40 ED1

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of Micro-electromechanical inertial shock switch threshold

47F/341/NP 2019-10 PRVN
  • PRVN
  • Preparation of RVN

2019-09

ACD
  • ACD
  • Approved for Committee Draft

2020-02

WG 3 wei zhang 2022-06
IEC 62047-41 ED1

Semiconductor devices - Micro-electromechanical devices – Part 41: RF MEMS Circulator and Isolator

47F/342/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-02

WG 3 li bo 2022-06