TC 91

Electronics assembly technology

 
export to xls file

TC 91 Work programme (28)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI TR 91-1 ED1

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

PWI
  • PWI
  • Preliminary Work Item

2018-12

2021-11

WG 3 Ichizo Sakamoto
PNW 91-1590

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

91/1590/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2020-06

WG 4 Douglas Sober 2021-12
IEC 60068-2-20 ED6

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

91/1650/CDV 2017-07 AFDIS
  • AFDIS
  • Approved for FDIS

2020-11

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2021-02

WG 3 Walter Huck 2021-09
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

91/1622/CDV 2016-12 AFDIS
  • AFDIS
  • Approved for FDIS

2020-11

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2021-03

WG 3 Walter Huck 2021-10
IEC 60194-1 ED1

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

91/1578/CDV 2017-08 RFDIS
  • RFDIS
  • FDIS received and registered

2020-10

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2021-01

WG 5 Min-su Lee 2021-04
IEC 61188-6-1 ED1

Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

91/1636/CDV 2018-01 TPUB
  • TPUB
  • Translation of publication

2020-11

DECPUB
  • DECPUB
  • Publication at Editing Check

2020-12

WG 12 Rainer Taube 2021-04
IEC 61188-6-2 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

91/1637/CDV 2019-07 TPUB
  • TPUB
  • Translation of publication

2020-11

DECPUB
  • DECPUB
  • Publication at Editing Check

2020-12

WG 12 Hiroyuki ISHIBASHI 2021-04
IEC TR 61188-8 ED1

Circuit boards and circuit board assemblies – Design and use – Part 8: 3D shape data for CAD component library

91/1640/DTR

2020-02 RPUB
  • RPUB
  • Text for PUB received and registered

2020-11

BPUB
  • BPUB
  • Publication being printed

2021-02

WG 12 Takaaki Murata 2021-03
IEC 61189-2-501 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

91/1661/CDV 2019-12 CCDV
  • CCDV
  • Draft circulated as CDV

2020-09

PRVC
  • PRVC
  • Preparation of RVC

2020-12

WG 10 Ying GE 2021-10
IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

91/1543/CD 2018-01 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2021-12
IEC 61189-2-803 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

91/1545/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2021-12
IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

91/1546/CD 2018-06 CDM
  • CDM
  • CD to be discussed at meeting

2019-09

2021-03

WG 10 Douglas Sober 2021-12
IEC 61189-2-805 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

91/1617/NP 2020-05 ACD
  • ACD
  • Approved for CD

2020-05

CD
  • CD
  • Draft circulated as CD

2020-08

WG 10 Min-su Lee 2022-08
IEC 61189-2-807 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

91/1647/CD 2019-12 PCC
  • PCC
  • Preparation of CC

2020-06

2020-07

WG 10 yuan gao 2022-01
IEC 61189-2-808 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

91/1638/NP 2020-09 ACD
  • ACD
  • Approved for CD

2020-09

CD
  • CD
  • Draft circulated as CD

2021-10

WG 10 Hyun Ho Kim 2023-10
IEC 61189-5-301 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles

91/1655/CDV 2019-09 PRVC
  • PRVC
  • Preparation of RVC

2020-11

2021-01

WG 3 Kaichi Tsuruta 2021-10
IEC 61189-5-501 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

91/1645/CDV 2018-10 RPUB
  • RPUB
  • Publication received and registered

2020-11

BPUB
  • BPUB
  • Publication being printed

2021-02

WG 3 Graham Naisbitt 2021-03
IEC 61189-5-502 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

91/1646/CDV 2019-04 DECPUB
  • DECPUB
  • Publication at Editing Check

2020-11

RPUB
  • RPUB
  • Text for PUB received and registered

2020-11

WG 3 Graham Naisbitt 2021-03
IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

91/1601/CDV 2015-11 DECPUB
  • DECPUB
  • Publication at Editing Check

2020-11

RPUB
  • RPUB
  • Text for PUB received and registered

2020-12

WG 3 Shigeru SUGINO 2021-03
IEC TR 61191-8 ED1

Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices

91/1665/DTR

2020-08 PRVDTR
  • PRVDTR
  • Preparation of RVDTR document

2020-10

APUB
  • APUB
  • Approved for publication

2021-05

WG 2 Udo Welzel 2021-06
IEC 61249-6-3 ED1

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

91/1548/CD 2018-07 TCDV
  • TCDV
  • Translation of CDV

2020-10

CCDV
  • CCDV
  • Draft circulated as CDV

2020-12

WG 4 Douglas Sober 2022-01
IEC 61760-2 ED3

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

91/1666/CDV 2019-07 CCDV
  • CCDV
  • Draft circulated as CDV

2020-10

PRVC
  • PRVC
  • Preparation of RVC

2021-01

WG 1 Kimmo B. Saarinen 2021-12
IEC 61760-3 ED2

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

91/1684/FDIS 2019-04 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2020-11

PRVD
  • PRVD
  • Preparation of RVD document

2021-01

WG 1 Tetsuji KAWAMATA 2021-03
IEC TR 62878-2-8 ED1

Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

91/1649/DTR

2020-04 PRVDTR
  • PRVDTR
  • Preparation of RVDTR document

2020-06

2021-01

WG 6 Min-su Lee 2021-06
IEC 62878-2-602 ED1

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

91/1663/CDV 2019-04 CCDV
  • CCDV
  • Draft circulated as CDV

2020-09

PRVC
  • PRVC
  • Preparation of RVC

2020-12

WG 6 Yoshihisa KATOH 2021-10
IEC 63215-2 ED1

Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

91/1660/CD 2018-09 PCC
  • PCC
  • Preparation of CC

2020-10

2021-06

WG 3 Hiroshi Nishikawa 2021-12
IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

91/1497/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2021-12

WG 3 Yoshiharu Kariya 2021-12
IEC 63251 ED1

Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

91/1626/CD 2019-05 ACDV
  • ACDV
  • Approved for CDV

2020-11

TCDV
  • TCDV
  • Translation of CDV

2021-02

WG 10 Young-Min Im 2021-12