International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (3)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47F-339

Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

47F/339/NP PNW
  • PNW
  • New Work Item Proposal

2019-07

PRVN
  • PRVN
  • Preparation of RVN document

2019-09

WG 2 2023-01
IEC 62047-35 ED1

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

47F/320/CDV 2017-07 TFDIS
  • TFDIS
  • Translation of FDIS

2019-07

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2019-08

WG 2 Shoji Kamiya 2020-03
IEC 62047-37 ED1

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

47F/336/CDV 2018-09 CCDV
  • CCDV
  • Draft circulated as CDV

2019-07

PRVC
  • PRVC
  • Preparation of RVC

2019-10

WG 2 Isaku KANNO 2020-09