SC 47E |
Discrete semiconductor devices |

Project Reference |
Document Reference |
Init. Date |
Current Stage |
Next Stage |
Working Group |
Project Leader |
Fcst. Publ. Date |
---|---|---|---|---|---|---|---|
PNW 47E-725 ED1
Semiconductor devices – Part 16-9: Microwave integrated circuits – Phase Shifters
|
47E/725/NP |
PRVN
2020-12 |
2021-01 |
WG 2 | li li | 2023-09 | |
IEC 60747-5-4 ED2
Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
|
47E/738/CDV | 2019-10 |
CCDV
2021-02 |
PRVC
2021-05 |
WG 9 | Junichi Yoshida | 2022-02 |
IEC 60747-5-6 ED2
Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
|
47E/701/CDV | 2019-02 |
RFDIS
2021-02 |
CFDIS
2021-05 |
WG 9 | Fumio Ogawa | 2021-08 |
IEC TR 60747-5-12 ED1
Semiconductor devices – Part 5-12: Optoelectronic devices – Light emitting diodes – Test method of LED efficiencies
|
47E/741/DTR | 2021-01 |
CDTR
2021-01 |
PRVDTR
2021-03 |
WG 9 | Jong-In Shim | 2021-11 |
IEC 60747-5-13 ED1
Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages
|
47E/702/CDV | 2018-09 |
RFDIS
2021-01 |
CFDIS
2021-03 |
WG 9 | Aki HIRAMOTO | 2021-06 |
IEC 60747-5-14 ED1
Semiconductor devices – Part 5-14: Optoelectronic devices – Light emitting diodes – Test method of the surface temperature based on the thermoreflectance method
|
47E/736/CDV | 2020-06 |
CCDV
2021-02 |
PRVC
2021-05 |
WG 9 | Jong-In Shim | 2022-02 |
IEC 60747-5-15 ED1
Semiconductor devices – Part 5-15: Optoelectronic devices – Light emitting diodes – Test method of the flat-band voltage based on the electroreflectance spectroscopy
|
47E/737/CDV | 2020-06 |
CCDV
2021-02 |
PRVC
2021-05 |
WG 9 | Dong-Soo Shin | 2022-02 |
IEC 60747-8/AMD1 ED3
Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
|
47E/726/CDV | 2019-01 |
PRVC
2021-02 |
2021-04 |
WG 3 | Yoshinori Iwano | 2021-11 |
IEC 60747-14-11 ED1
Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
|
47E/674/CDV | 2017-06 |
BPUB
2021-02 |
PPUB
2021-03 |
PT 60747-14-11 | Kunnyun Kim | 2021-03 |
IEC 60747-16-7 ED1
Semiconductor devices – Part 16-7: Microwave integrated circuits – Attenuators
|
47E/734/CD | 2020-02 |
CD
2020-12 |
PCC
2021-03 |
WG 2 | deng shixiong | 2022-03 |
IEC 60747-16-8 ED1
Semiconductor devices – Part 16-8: Microwave integrated circuits – Limiters
|
47E/735/CD | 2020-02 |
CD
2020-12 |
PCC
2021-03 |
WG 2 | deng shixiong | 2022-03 |
IEC 60747-18-4 ED1
Semiconductor devices – Part 18-4: Semiconductor bio sensors – Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
|
47E/718/NP | 2021-01 |
ACD
2021-01 |
CD
2021-05 |
WG 1 | JongMuk LEE | 2023-12 |
IEC 60747-18-5 ED1
Semiconductor devices – Part 18-5: Semiconductor bio sensors – Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light
|
47E/719/NP | 2021-01 |
ACD
2021-01 |
CD
2021-05 |
WG 1 | JongMuk LEE | 2023-12 |
IEC TS 60747-19-2 ED1
Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of smart sensors and power supplies to drive smart sensors
|
47E/693/DTS |
2019-06 |
APUB
2021-02 |
|
WG 1 | Kazuyoshi Furuta | 2021-08 |
