SC 47A |
Integrated circuits |
SC 47A Work programme (8)
Project Reference |
Document Reference |
Init. Date |
Current Stage |
Next Stage |
Working Group |
Project Leader |
Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
|
PWI 47A-9
Semiconductor devices – Fault test method for automotive vehicles – Part 2 Electromagnetic Susceptibility from automotive RADAR
|
PWI
2019-12 |
prePNW
2021-05 |
Wonjong KIM | ||||
|
PWI TR 47A-10 ED1
Future IEC TR 62433-X : EMC IC modelling – Part X: Use of ICIM-CI model in an application board modelling
|
PWI
2019-12 |
2021-05 |
WG 2 | André Durier | |||
|
IEC 61967-4 ED2
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method
|
47A/1101/CDV | 2018-11 |
BPUB
2021-03 |
PPUB
2021-04 |
WG 9 | Frank Klotz | 2021-04 |
|
IEC 62228-5 ED1
Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers
|
47A/1115/FDIS | 2018-05 |
CFDIS
2021-02 |
PRVD
2021-03 |
WG 9 | Bernd Körber | 2021-06 |
|
IEC 62228-6 ED1
Integrated circuit – EMC Evaluation of transceivers – Part 6: PSI5 transceivers
|
47A/1116/CD | 2020-05 |
CD
2021-02 |
PCC
2021-05 |
WG 9 | Abhishek Ramanujan | 2023-02 |
|
IEC 62228-7 ED1
Integrated circuits - EMC evaluation of transceivers – Part 7: CXPI transceivers
|
47A/1114/CD | 2018-04 |
CD
2021-01 |
PCC
2021-03 |
WG 9 | Yasuyuki Ishikawa | 2022-04 |
|
IEC 63011-5 ED1
Integrated circuits - Three dimensional integrated circuits - Part 5: Known-good-die test of partly integrated circuits
|
47A/1081/NP | 2019-11 |
ACD
2019-11 |
CD
2021-05 |
WG 7 | Kee-Won Kwon | 2022-10 |
|
IEC 63011-6 ED1
Integrated circuits - Three dimensional integrated circuits - Part 6: Thermomechanical reliability test method
|
47A/1082/NP | 2019-11 |
ACD
2019-11 |
CD
2021-05 |
WG 7 | Kee-Won Kwon | 2022-10 |
3316 kB