International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47E

Discrete semiconductor devices

 
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SC 47E Work programme (12)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 60747-5-4 ED2

Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

47E/687/CD 2019-10 CDM
  • CDM
  • CD to be discussed at meeting

2020-02

2020-12

WG 9 Junichi Yoshida 2021-11
IEC 60747-5-6 ED2

Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes

47E/701/CDV 2019-02 PRVC
  • PRVC
  • Preparation of RVC

2020-07

2020-10

WG 9 Fumio Ogawa 2021-04
IEC TR 60747-5-12 ED1

Semiconductor devices – Part 5-12: Optoelectronic devices – Light emitting diodes – Test method of LED efficiencies

47E/710/CD CD
  • CD
  • Committee Draft

2020-05

PCC
  • PCC
  • Preparation of CC document

2020-08

WG 9 Jong-In Shim 2021-04
IEC 60747-5-13 ED1

Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages

47E/702/CDV 2018-09 PRVC
  • PRVC
  • Preparation of RVC

2020-07

2020-10

WG 9 Fumio Ogawa 2021-04
IEC 60747-5-14 ED1

Semiconductor devices – Part 5-14: Optoelectronic devices – Light emitting diodes – Test method of the junction temperature based on the thermoreflectance method

47E/703/NP 2020-06 ACD
  • ACD
  • Approved for CD

2020-06

CD
  • CD
  • Draft circulated as CD

2020-12

WG 9 Jong-In Shim 2022-05
IEC 60747-5-15 ED1

Semiconductor devices – Part 5-15: Optoelectronic devices – Light emitting diodes – Test method of the internal electric field based on the electroreflectance spectroscopy

47E/704/NP 2020-06 ACD
  • ACD
  • Approved for CD

2020-06

CD
  • CD
  • Draft circulated as CD

2020-12

WG 9 Dong-Soo Shin 2022-05
IEC 60747-8/AMD1 ED3

Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

47E/669/CD 2019-01 ACDV
  • ACDV
  • Approved for CDV

2020-05

TCDV
  • TCDV
  • Translation of CDV

2020-08

WG 3 Yoshinori Iwano 2021-12
IEC 60747-14-11 ED1

Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature

47E/674/CDV 2017-06 APUB
  • APUB
  • Approved for publication

2020-05

APUB
  • APUB
  • Approved for publication

2020-07

PT 60747-14-11 Kunnyun Kim 2021-03
IEC 60747-16-7 ED1

Semiconductor devices – Part 16-7: Microwave integrated circuits – Attenuators

47E/698/CD 2020-02 PCC
  • PCC
  • Preparation of CC

2020-05

2020-06

WG 2 deng shixiong 2022-03
IEC 60747-16-8 ED1

Semiconductor devices – Part 16-8: Microwave integrated circuits – Limiters

47E/699/CD 2020-02 PCC
  • PCC
  • Preparation of CC

2020-05

2020-06

WG 2 deng shixiong 2022-03
IEC 60747-17 ED1

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

47E/711/FDIS

2015-01 BPUB
  • BPUB
  • Being published

2020-08

PPUB
  • PPUB
  • Publication published

2020-09

WG 8 Alexander Jaus 2020-09
IEC TS 60747-19-2 ED1

Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of smart sensors and power supplies to drive smart sensors

47E/693/DTS

2019-06 PRVDTS
  • PRVDTS
  • Preparation of RVDTS

2020-02

2020-05

WG 1 Kazuyoshi Furuta 2021-02