International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (5)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62047-35 ED1

Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

47F/344/FDIS


2017-07 BPUB
  • BPUB
  • Being published

2019-11

PPUB
  • PPUB
  • Publication published

2019-12

WG 2 Shoji Kamiya 2019-12
IEC 62047-37 ED1

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

47F/336/CDV 2018-09 AFDIS
  • AFDIS
  • Approved for FDIS

2019-10

TFDIS
  • TFDIS
  • Translation of FDIS

2020-01

WG 2 Isaku KANNO 2020-10
IEC 62047-38 ED1

Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

47F/339/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-01

WG 2 Jae-Hyun Kim 2022-04
IEC 62047-40 ED1

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of Micro-electromechanical inertial shock switch threshold

47F/341/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-02

WG 3 wei zhang 2022-06
IEC 62047-41 ED1

Semiconductor devices - Micro-electromechanical devices – Part 41: RF MEMS Circulator and Isolator

47F/342/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-02

WG 3 li bo 2022-06